IRS20957STR-JSM

IRS20957STR-JSM


Specifications
SKU
12596458
Details

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Parameter Description Min Typ Max Unit
VCC Supply Voltage 10.5 - 20 V
IOUT Output Current - 3.5 4.5 A
fSW Switching Frequency 200 - 1000 kHz
VGS(th) Gate-Source Threshold Voltage 2.0 2.5 3.0 V
RDS(on) On-State Resistance - 0.35 0.45 Ω
td(on) Turn-On Delay Time 30 - 50 ns
tr Rise Time 25 - 40 ns
td(off) Turn-Off Delay Time 35 - 55 ns
tf Fall Time 20 - 35 ns
VDS(max) Drain-Source Breakdown Voltage - - 600 V
TJ Junction Temperature -55 - 150 °C
TSTG Storage Temperature Range -55 - 150 °C

Instructions for Use:

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 10.5V to 20V to avoid damage or improper operation.
  2. Output Current (IOUT):

    • The device can handle output currents up to 4.5A. Do not exceed this limit to prevent overheating or failure.
  3. Switching Frequency (fSW):

    • Operate the device within the switching frequency range of 200kHz to 1000kHz to ensure optimal performance.
  4. Gate-Source Threshold Voltage (VGS(th)):

    • The device will start conducting when the gate-source voltage exceeds 2.0V. Ensure the control circuit provides a sufficient gate drive to turn the device on reliably.
  5. On-State Resistance (RDS(on)):

    • The on-state resistance is typically 0.35Ω at room temperature. This value can increase with temperature, so consider thermal management in high-power applications.
  6. Timing Parameters:

    • Ensure that the turn-on delay time (td(on)), rise time (tr), turn-off delay time (td(off)), and fall time (tf) are within the specified ranges to avoid timing issues in your circuit.
  7. Drain-Source Breakdown Voltage (VDS(max)):

    • The maximum drain-source voltage is 600V. Ensure that the device is not subjected to voltages exceeding this limit to prevent breakdown.
  8. Temperature Considerations:

    • The junction temperature (TJ) should be kept between -55°C and 150°C. Proper heat sinking may be required in high-power applications.
    • The storage temperature range (TSTG) is also -55°C to 150°C. Store the device in a controlled environment to prevent damage.
  9. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow proper soldering techniques to ensure reliable connections and avoid thermal shock.
  10. Application Notes:

    • Refer to the datasheet and application notes for specific circuit design recommendations and examples.
    • For high-frequency applications, pay attention to parasitic inductances and capacitances to minimize noise and improve efficiency.
(For reference only)

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