Details

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BUY BUK9Y19-55B/DS https://www.utsource.net/itm/p/12596505.html

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Continuous Drain Current	ID	-	42	-	A	@ Tc = 25掳C, VGS = 10V, tD = 1s
Pulse Drain Current	Ipp	-	126	-	A	@ Tc = 25掳C, VGS = 10V, tpp = 100渭s, duty cycle = 1%
Drain-Source Voltage	VDS	-	-	55	V
Gate-Source Voltage	VGS	-20	-	15	V
Gate Charge	QG	-	88	-	nC	@ VDS = 55V, VGS = 10V, ID = 1A
Input Capacitance	Ciss	-	3750	-	pF	@ VDS = 55V, VGS = 0V
Output Capacitance	Coss	-	750	-	pF	@ VDS = 55V, VGS = 0V
Reverse Transfer Capacitance	Crss	-	1150	-	pF	@ VDS = 55V, VGS = 0V
RDS(on)	RDS(on)	-	4.5	-	m惟	@ VGS = 10V, ID = 42A, Tc = 25掳C
Total Power Dissipation	PD	-	-	220	W	@ Tc = 25掳C
Junction Temperature	TJ	-20	-	175	掳C
Storage Temperature	Tstg	-55	-	150	掳C

Instructions for Use:

1. Mounting and Handling:

   • Ensure proper handling to avoid damage to the device.
   • Use appropriate heat sinks to manage thermal dissipation.

2. Electrical Connections:

   • Connect the drain (D) to the high-voltage side of the circuit.
   • Connect the source (S) to the low-voltage side or ground.
   • Apply the gate (G) voltage relative to the source to control the MOSFET.

3. Operating Conditions:

   • Do not exceed the maximum ratings specified in the table.
   • Ensure the junction temperature does not exceed 175掳C.
   • For continuous operation, keep the drain current within the rated limits.

4. Thermal Management:

   • Use a heatsink with adequate thermal resistance to maintain the junction temperature within safe limits.
   • Consider forced air cooling or other cooling methods for high-power applications.

5. Gate Drive:

   • Use a gate driver circuit to provide the necessary gate voltage.
   • Ensure the gate voltage is within the specified range to avoid damage or improper operation.

6. Storage:

   • Store the device in a dry, cool place to prevent moisture damage.
   • Handle with ESD precautions to avoid static discharge damage.

7. Testing:

   • Perform initial testing at lower power levels to ensure proper operation before full-scale deployment.
   • Monitor temperature and performance during testing to ensure reliability.

(For reference only)