Details

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BUY OB5283CPA https://www.utsource.net/itm/p/12596554.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VDD	Operating	2.7	-	5.5	V
Quiescent Current	IQ	No Load, VDD = 5V	-	100	-	μA
Output Voltage	VOUT	VDD = 5V, IOUT = 100mA	4.8	5.0	5.2	V
Load Regulation	ΔVOUT	IOUT = 0 to 100mA	-	20	-	mV
Line Regulation	ΔVOUT	VDD = 2.7 to 5.5V	-	5	-	mV
Dropout Voltage	VDROPOUT	IOUT = 100mA	-	250	-	mV
Thermal Shutdown	TSD	-	-	150	-	°C
Short-Circuit Protection	ISCP	Continuous	-	300	-	mA

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (VDD) is within the operating range of 2.7V to 5.5V.
   • Connect a bypass capacitor (typically 10μF) between VDD and GND as close to the device as possible to minimize noise and improve stability.

2. Output Configuration:

   • The output voltage (VOUT) is typically set to 5.0V when VDD is 5V. For other supply voltages, refer to the load regulation and line regulation parameters to ensure stable operation.
   • Use an appropriate output capacitor (typically 10μF) to filter the output and stabilize the voltage.

3. Thermal Management:

   • Monitor the thermal shutdown temperature (TSD) to avoid overheating. The device will automatically shut down if the junction temperature exceeds 150°C.
   • Ensure adequate heat dissipation by using a heatsink or PCB with good thermal conductivity if the device is expected to operate at high power levels.

4. Protection Features:

   • The device includes short-circuit protection (ISCP) which limits the output current to approximately 300mA to prevent damage.
   • In the event of a short circuit, the device will automatically limit the current and may enter thermal shutdown if the temperature exceeds the threshold.

5. Application Notes:

   • For optimal performance, follow the recommended PCB layout guidelines provided in the datasheet.
   • Ensure that all connections are secure and free from soldering defects to avoid reliability issues.

6. Storage and Handling:

   • Store the device in a dry, cool place to prevent moisture damage.
   • Handle the device with care to avoid static discharge, which can damage the internal components. Use ESD-protected equipment and work surfaces.

(For reference only)