74AHCT32N

74AHCT32N


Specifications
SKU
12597161
Details

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Parameter Symbol Min Typ Max Unit Notes
Supply Voltage VCC 2.0 - 5.5 V
Input Low Voltage VIL - - 1.5 V
Input High Voltage VIH 3.5 - - V
Output Low Voltage VOL 0.0 - 0.4 V @ IOL = 8 mA
Output High Voltage VOH 4.5 - VCC V @ IOH = -4 mA
Input Leakage Current IIL -1 - 1 渭A
Output Leakage Current IOL - - 50 渭A @ VOH = 4.5 V
Propagation Delay Time tpLH, tpHL - 10 25 ns @ VCC = 5 V, TA = 25掳C
Power Dissipation PD - - 100 mW
Operating Temperature Range TA -40 - 85 掳C
Storage Temperature Range TSTG -65 - 150 掳C

Instructions for Use:

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 2.0 V to 5.5 V to avoid damage to the device.
  2. Input Voltage Levels:

    • For a logic low input, ensure the voltage is below 1.5 V.
    • For a logic high input, ensure the voltage is above 3.5 V.
  3. Output Voltage Levels:

    • When the output is low, it should be less than 0.4 V when sourcing 8 mA.
    • When the output is high, it should be at least 4.5 V when sinking -4 mA.
  4. Current Ratings:

    • Input leakage current should not exceed 卤1 渭A.
    • Output leakage current should not exceed 50 渭A when the output is high.
  5. Propagation Delay:

    • The propagation delay time should be between 10 ns and 25 ns at 5 V supply voltage and 25掳C ambient temperature.
  6. Power Dissipation:

    • Ensure the power dissipation does not exceed 100 mW to prevent overheating.
  7. Temperature Ranges:

    • The operating temperature range is from -40掳C to 85掳C.
    • The storage temperature range is from -65掳C to 150掳C.
  8. Handling Precautions:

    • Handle with care to avoid static discharge which can damage the IC.
    • Ensure proper grounding and use anti-static wrist straps if necessary.
  9. Mounting and Soldering:

    • Follow standard soldering procedures to avoid thermal shock.
    • Ensure the PCB layout provides adequate heat dissipation if the device will operate near its maximum power dissipation.
  10. Testing:

    • Test the device under typical operating conditions to ensure it meets the specified parameters.
(For reference only)

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