ACS108-8SN-TR

ACS108-8SN-TR


Specifications
SKU
12597194
Details

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Parameter Description Value
Part Number Full part number ACS108-8SN-TR
Package Type Package type SOIC-8
Operating Voltage Supply voltage range 4.5V to 5.5V
Output Type Output signal type Analog
Bandwidth Frequency range 80 kHz
Current Range Measurable current range 卤80A
Sensitivity Output sensitivity at nominal supply voltage 100 mV/A
Quiescent Current Supply current 12 mA (max)
Isolation Voltage Isolation between primary and secondary circuits 2.5 kVrms (1 min)
Temperature Range Operating temperature range -40掳C to +85掳C
Storage Temperature Storage temperature range -65掳C to +150掳C
Lead Finish Lead finish type SnPb (63/37)
RoHS Compliance RoHS compliance Non-RoHS

Instructions for Use

  1. Power Supply:

    • Ensure the supply voltage is within the specified range of 4.5V to 5.5V.
    • Connect the VCC pin to the positive supply and GND pin to the ground.
  2. Current Sensing:

    • Place the current-carrying conductor through the center hole of the sensor.
    • The current flowing through the conductor will generate a magnetic field, which is detected by the Hall effect sensor inside the device.
  3. Output Signal:

    • The output voltage (VOUT) is proportional to the sensed current.
    • For a nominal supply voltage of 5V, the sensitivity is 100 mV/A.
    • The output is centered around half the supply voltage (2.5V for 5V supply).
  4. Calibration:

    • If necessary, calibrate the output using a known current source to ensure accuracy.
    • Adjust any external circuitry to account for the offset and gain.
  5. Handling and Storage:

    • Handle the device with care to avoid damage to the leads and package.
    • Store the device in a dry environment within the specified storage temperature range.
  6. Safety Precautions:

    • Ensure proper isolation when handling high currents to prevent electrical shock.
    • Do not exceed the maximum operating voltage or current ratings to avoid damaging the device.
  7. Mounting:

    • Mount the device on a PCB using standard soldering techniques.
    • Ensure proper thermal management if operating at high temperatures or currents.
  8. Testing:

    • Test the device in a controlled environment to verify its performance before integrating it into the final application.
(For reference only)

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