TLP700H(TP,F)

TLP700H(TP,F)

Category: IC Chips

Specifications
Details

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Parameter Symbol Min Typ. Max Unit Conditions
Forward Voltage VF 1.0 1.2 1.4 V IF = 50 mA
Reverse Breakdown Voltage VR - 5.0 - V IR = 1 mA
Forward Current IF - 50 - mA VF = 1.2 V
Output Current IO - 30 - mA VO = 4.5 V
Isolation Voltage VIORM - 2500 - Vrms 1 min, 50/60 Hz
Insulation Resistance RISO 500 - - VIF = 500 Vdc
Propagation Delay Time tPLH 10 18 26 μs IF = 50 mA, IO = 30 mA
Storage Temperature TSTG -40 - 105 °C -
Operating Temperature TOPR -40 - 85 °C -

Instructions for TLP700H(TP,F)

  1. Mounting and Handling:

    • Handle with care to avoid damage.
    • Ensure proper heat sinking if operating at high currents.
  2. Electrical Connections:

    • Connect the forward current (IF) leads correctly to avoid reverse polarity which can damage the device.
    • Ensure that the output current (IO) does not exceed the maximum rating of 30 mA to prevent overheating.
  3. Insulation and Safety:

    • Maintain a minimum isolation voltage of 2500 Vrms for safety and performance.
    • Regularly check insulation resistance to ensure it meets or exceeds 500 MΩ.
  4. Temperature Considerations:

    • Operate within the specified temperature range (-40°C to 85°C) for optimal performance.
    • Store in environments between -40°C and 105°C to avoid degradation.
  5. Timing and Delays:

    • Account for propagation delay times (tPLH) when designing circuits to ensure accurate timing.
  6. Testing:

    • When testing, apply voltages and currents within specified limits to avoid damaging the component.
    • Use appropriate test equipment calibrated to measure small currents and voltages accurately.
(For reference only)

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