Details

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BUY TLP718F https://www.utsource.net/itm/p/12597234.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	VCC	4.5	-	20	V	-
Forward Current	IF	-	20	50	mA	-
Output Current (Max)	IO	-	-	5	mA	VCE(sat) = 0.4V, TA = 25掳C
Output Voltage (High)	VOH	-	3.5	5	V	IO = -0.4mA, VCC = 5V, TA = 25掳C
Output Voltage (Low)	VOL	-	0.4	0.6	V	IO = 5mA, VCC = 5V, TA = 25掳C
Isolation Voltage	VIORM	-	2500	-	Vrms	-
Insulation Withstand Voltage	VIOWM	-	4000	-	Vpeak	-
Propagation Delay Time	tPLH, tPHL	-	200	400	ns	VCC = 5V, IF = 20mA, RL = 1k惟, VOH = 2V, VOL = 0.4V, TA = 25掳C
Storage Temperature	TSTG	-40	-	105	掳C	-
Operating Temperature	TA	-40	-	85	掳C	-

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 4.5V to 20V.
   • Connect the power supply to the V_CC and GND pins.

2. Forward Current:

   • The forward current (I_F) should be set between 20mA and 50mA to ensure reliable operation.

3. Output Current:

   • The maximum output current (I_O) is 5mA. Ensure that the load connected to the output does not exceed this limit to avoid damage.

4. Output Voltage Levels:

   • When the output is high, the voltage (V_OH) will be between 3.5V and 5V.
   • When the output is low, the voltage (V_OL) will be between 0.4V and 0.6V.

5. Isolation:

   • The TLP718F provides electrical isolation up to 2500Vrms and can withstand peak voltages up to 4000Vpeak. Ensure that the input and output circuits are properly isolated to prevent electrical hazards.

6. Propagation Delay:

   • The propagation delay time (t_PLH and t_PHL) is typically 200ns with a maximum of 400ns. This should be considered when designing timing-sensitive applications.

7. Temperature Considerations:

   • The storage temperature range is from -40掳C to 105掳C, and the operating temperature range is from -40掳C to 85掳C. Ensure that the device is used within these temperature limits to maintain reliability.

8. Handling and Installation:

   • Handle the TLP718F with care to avoid static discharge and physical damage.
   • Follow proper soldering techniques and ensure good thermal management if the device is expected to operate at higher temperatures.

9. Testing:

   • Before integrating the TLP718F into a final design, perform thorough testing to ensure it meets the required performance specifications under all operating conditions.

(For reference only)