Details
BUY FQP8N80C https://www.utsource.net/itm/p/12597240.html
Parameter | Symbol | Min | Typ | Max | Unit | Notes |
---|---|---|---|---|---|---|
Drain-Source Voltage | VDS | -80 | - | 80 | V | |
Gate-Source Voltage | VGS | -20 | - | 20 | V | |
Continuous Drain Current | ID | - | 16 | 16 | A | @ TC = 25°C |
Pulse Drain Current | ID(p) | - | 32 | 32 | A | @ TC = 25°C, tp = 10 μs, Duty Cycle = 1% |
Power Dissipation | PTOT | - | - | 190 | W | @ TC = 25°C |
Junction Temperature | TJ | - | - | 175 | °C | |
Storage Temperature | TSTG | -65 | - | 150 | °C |
Instructions for Use:
Handling Precautions:
- The FQP8N80C is sensitive to electrostatic discharge (ESD). Use proper ESD protection measures during handling and installation.
- Avoid exceeding the maximum ratings specified in the table to prevent damage to the device.
Mounting:
- Ensure that the device is securely mounted to a heatsink if operating at high power levels to maintain junction temperature within safe limits.
- Use thermal compound between the device and heatsink to improve heat transfer.
Gate Drive:
- Apply a gate-source voltage (VGS) within the specified range to turn the MOSFET on or off.
- For optimal performance, use a gate resistor to control the switching speed and reduce electromagnetic interference (EMI).
Operating Conditions:
- Monitor the drain current (ID) and ensure it does not exceed the continuous or pulse ratings depending on the application.
- Keep the junction temperature (TJ) below the maximum rating to avoid thermal runaway and potential failure.
Testing:
- When testing the device, use a controlled environment to simulate actual operating conditions.
- Verify that the device meets the specified electrical characteristics under these conditions.
Storage:
- Store the device in a dry, cool place away from direct sunlight and sources of heat.
- Follow recommended storage temperature ranges to prevent degradation.
For more detailed information, refer to the datasheet provided by the manufacturer.
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