Details

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BUY TSB41AB1PHP https://www.utsource.net/itm/p/12597430.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Supply Voltage	VCC	2.7	-	5.5	V
Operating Temperature	TOPR	-40	-	85	掳C
Storage Temperature	TSTG	-65	-	150	掳C
Input Voltage Range	VIN	0	-	5.5	V
Output Voltage Range	VOUT	0	-	5.5	V
Quiescent Current	IQ	-	0.5	1	渭A	@ VCC = 3.3V, TA = 25掳C
Load Current	ILOAD	-	-	100	mA	Continuous
Output Ripple Voltage	Vripp	-	20	50	mV	@ f = 100 kHz, COUT = 10 渭F
Shutdown Current	ISD	-	0.1	0.5	渭A	@ VCC = 3.3V, TA = 25掳C
Enable Input High Level	VENH	1.8	-	5.5	V
Enable Input Low Level	VENL	0	-	0.8	V
Thermal Shutdown	TSD	-	-	160	掳C

Instructions for Use

1. Power Supply:

   • Ensure the supply voltage (VCC) is within the range of 2.7V to 5.5V.
   • Connect a bypass capacitor (typically 100nF) close to the VCC pin to filter out noise.

2. Temperature Considerations:

   • The operating temperature range is from -40掳C to 85掳C.
   • The storage temperature range is from -65掳C to 150掳C.

3. Input and Output:

   • The input voltage (VIN) should be within the same range as the supply voltage.
   • The output voltage (VOUT) can also be within the same range as the supply voltage.
   • Use appropriate output capacitors to stabilize the output and reduce ripple.

4. Quiescent Current:

   • The quiescent current (IQ) is typically 0.5渭A at 3.3V and 25掳C, but it can go up to 1渭A.

5. Load Current:

   • The device can handle a continuous load current (ILOAD) of up to 100mA.

6. Output Ripple Voltage:

   • The typical output ripple voltage (Vripp) is 20mV, with a maximum of 50mV at 100kHz and a 10渭F output capacitor.

7. Shutdown Current:

   • When the device is in shutdown mode, the current consumption (ISD) is typically 0.1渭A at 3.3V and 25掳C, with a maximum of 0.5渭A.

8. Enable Input:

   • The enable input (EN) should be high (VENH) between 1.8V and 5.5V to turn the device on.
   • The enable input should be low (VENL) between 0V and 0.8V to turn the device off.

9. Thermal Shutdown:

   • The device will automatically shut down if the temperature exceeds 160掳C to prevent damage.

10. Layout Considerations:

    • Place the device and its associated components as close as possible to minimize parasitic effects.
    • Use wide traces for power and ground connections to reduce resistance and inductance.

11. Capacitor Selection:

    • Choose capacitors with low ESR (Equivalent Series Resistance) to ensure stable operation and minimal ripple.

12. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage the internal circuitry.
    • Follow proper soldering techniques to ensure reliable connections and prevent thermal damage.

(For reference only)