Details

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BUY IRFZ24NPBF https://www.utsource.net/itm/p/12597559.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Drain-Source Voltage	VDS	-	-	55	V
Gate-Source Voltage	VGS	-20	-	12	V
Continuous Drain Current	ID	-	19	-	A	TC = 25掳C
Continuous Drain Current	ID	-	11	-	A	TC = 100掳C
Pulse Drain Current	IDM	-	67	-	A	tp = 10 ms, IG = 11 A, TC = 25掳C
Total Power Dissipation	PTOT	-	-	118	W	TC = 25掳C
Junction Temperature	TJ	-	-	175	掳C
Storage Temperature	TSTG	-55	-	150	掳C

Instructions for Use:

1. Voltage Ratings:

   • Ensure that the drain-source voltage (V_DS) does not exceed 55V.
   • The gate-source voltage (V_GS) should be kept between -20V and 12V to avoid damage.

2. Current Handling:

   • The continuous drain current (I_D) should not exceed 19A at a case temperature (T_C) of 25掳C.
   • At a case temperature of 100掳C, the continuous drain current should not exceed 11A.
   • For pulse applications, the peak drain current (I_DM) can reach up to 67A for a pulse duration of 10ms, with a gate current (I_G) of 11A and a case temperature of 25掳C.

3. Power Dissipation:

   • The total power dissipation (P_TOT) should not exceed 118W at a case temperature of 25掳C.

4. Temperature Limits:

   • The junction temperature (T_J) should not exceed 175掳C.
   • The storage temperature (T_STG) range is from -55掳C to 150掳C.

5. Mounting and Heat Sinking:

   • Proper heat sinking is essential to manage the junction temperature, especially during high current or high power operations.
   • Ensure good thermal contact between the device and the heat sink to maximize heat dissipation.

6. Gate Drive:

   • Use appropriate gate drive circuits to ensure reliable switching. Avoid excessive gate-source voltage to prevent damage.
   • Ensure the gate resistor is properly chosen to control the switching speed and minimize switching losses.

7. Storage and Handling:

   • Store the device in a dry, cool environment within the specified storage temperature range.
   • Handle the device with care to avoid mechanical stress and static discharge, which can damage the sensitive components.

8. Testing and Verification:

   • Before deploying the device in a final application, perform thorough testing under all expected operating conditions to ensure reliability and performance.

(For reference only)