Details
BUY OB2338SP https://www.utsource.net/itm/p/12597594.html
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VDD | 2.0 | 5.5 | V | ||
| Operating Temperature | Toper | -40 | 85 | 掳C | ||
| Storage Temperature | Tstg | -65 | 150 | 掳C | ||
| Output Current per Channel | IOUT | Continuous, Ta=25掳C | 50 | mA | ||
| Quiescent Current | IQ | VIN=3V | 20 | 渭A | ||
| Shutdown Current | ISD | VIN=3V | 0.1 | 渭A | ||
| Output Low Voltage | VOL | IOL=50mA | 0.4 | V | ||
| Output High Voltage | VOH | IOH=-50mA | 2.4 | V |
Instructions for OB2338SP
Power Supply Requirements:
- Ensure the supply voltage (VDD) is within the range of 2.0V to 5.5V.
Temperature Considerations:
- The device can operate between -40掳C and 85掳C.
- Store the device between -65掳C and 150掳C.
Current Handling:
- Each channel can handle up to 50mA continuously at room temperature (Ta=25掳C).
Power Management:
- The quiescent current should be around 20渭A when operating at 3V.
- In shutdown mode, the current draw should not exceed 0.1渭A at 3V.
Output Voltage Levels:
- When sourcing current (IOH=-50mA), ensure the output high voltage (VOH) remains above 2.4V.
- When sinking current (IOL=50mA), ensure the output low voltage (VOL) stays below 0.4V.
Handling and Installation:
- Handle with care to avoid damage from electrostatic discharge (ESD).
- Follow manufacturer guidelines for soldering and PCB layout to ensure optimal performance.
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