Details

---

BUY SN74ALS641A-1N https://www.utsource.net/itm/p/12597884.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Operating	4.75	5.0	5.25	V
Input Voltage (High)	VIH	Input High Level	3.15	-	5.25	V
Input Voltage (Low)	VIL	Input Low Level	0	-	2.0	V
Output Voltage (High)	VOH	Output High Level, IOL = 0.4 mA	2.4	-	5.0	V
Output Voltage (Low)	VOL	Output Low Level, IOH = 8 mA	0	-	0.5	V
Propagation Delay Time	tpd	Typical at VCC = 5V, TA = 25掳C	-	16	-	ns
Power Dissipation	PD	Maximum at TA = 25掳C	-	-	100	mW
Operating Temperature Range	TOP	-	-40	-	85	掳C
Storage Temperature Range	TSTG	-	-65	-	150	掳C

Instructions for Use:

1. Supply Voltage:

   • Ensure the supply voltage (V_CC) is within the specified range of 4.75V to 5.25V to avoid damage to the device.

2. Input Levels:

   • For a valid high input (V_IH), the voltage must be between 3.15V and 5.25V.
   • For a valid low input (V_IL), the voltage must be between 0V and 2.0V.

3. Output Levels:

   • The output high level (V_OH) should be at least 2.4V when sourcing 0.4 mA.
   • The output low level (V_OL) should be no more than 0.5V when sinking 8 mA.

4. Propagation Delay:

   • The typical propagation delay time (t_pd) is 16 ns at V_CC = 5V and T_A = 25掳C. This value can vary with different conditions.

5. Power Dissipation:

   • The maximum power dissipation (P_D) is 100 mW at T_A = 25掳C. Ensure proper heat dissipation if operating near this limit.

6. Temperature Ranges:

   • The operating temperature range (T_OP) is from -40掳C to 85掳C.
   • The storage temperature range (T_STG) is from -65掳C to 150掳C.

7. Handling and Storage:

   • Store the device in a dry, cool place to prevent moisture damage.
   • Handle the device with care to avoid static discharge, which can damage the internal circuits.

8. Mounting and Soldering:

   • Follow standard soldering procedures to ensure reliable connections.
   • Avoid excessive heat during soldering to prevent damage to the device.

9. Testing:

   • Use appropriate test equipment and methods to verify the functionality of the device.
   • Refer to the datasheet for specific test conditions and procedures.

(For reference only)