YGW60N65F1A2

YGW60N65F1A2

Category: Transistors

Specifications
Details

BUY YGW60N65F1A2 https://www.utsource.net/itm/p/12598103.html

Parameter Symbol Min Typ Max Unit Description
Breakdown Voltage V(BR)DSS - 650 - V Drain-to-source breakdown voltage
Continuous Drain Current ID - 60 - A Continuous drain current at Tc = 25°C
Pulse Drain Current IDM - 180 - A Pulse drain current (t=10μs, duty 1%)
Gate-Source Voltage VGS -10 - 20 V Maximum gate-to-source voltage
Total Power Dissipation PD - 390 - W Total power dissipation at Tc = 25°C
Junction Temperature TJ -55 - 175 °C Operating junction temperature range
Storage Temperature TSTG -55 - 175 °C Storage temperature range
Thermal Resistance RθJC - 0.4 - °C/W Junction to case thermal resistance

Instructions for YGW60N65F1A2:

  1. Handling Precautions:

    • Avoid exposing the device to temperatures outside the specified operating and storage ranges.
    • Handle with care to prevent mechanical damage.
  2. Installation:

    • Ensure proper heat sinking to manage thermal resistance and maintain optimal performance.
    • Use appropriate mounting hardware and follow manufacturer guidelines for torque specifications.
  3. Electrical Connections:

    • Connect the gate terminal through a resistor to limit inrush current and reduce noise.
    • Ensure all connections are secure and insulated as necessary to prevent short circuits.
  4. Operation:

    • Operate within the continuous and pulse current ratings to avoid overheating and potential damage.
    • Monitor the junction temperature to ensure it remains within safe limits during operation.
  5. Storage:

    • Store in a dry environment within the specified storage temperature range.
    • Protect from static electricity by using anti-static packaging.
  6. Testing:

    • Perform initial testing under controlled conditions to verify functionality and performance.
    • Regularly inspect for signs of wear or damage, especially after prolonged use or exposure to extreme conditions.
(For reference only)

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