LTC3865EUH-1#PBF

LTC3865EUH-1#PBF

Category: IC Chips

Specifications
SKU
12598197
Details

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Parameter Symbol Min Typical Max Unit
Input Voltage Range VIN 4.5 - 60 V
Output Voltage Range VOUT 0.8 - 55 V
Switching Frequency fSW 200 - 1000 kHz
Quiescent Current IQ - 90 - μA
Output Current Limit ILIM - 40 - A
Efficiency η - - 97 %
Operating Temperature TOPR -40 - 125 °C
Storage Temperature TSTG -65 - 150 °C
Package Type PKG - - - 5x6mm
Lead-Free Pb-Free - Yes - -

Instructions for Use:

  1. Input Voltage (VIN):

    • Ensure the input voltage is within the range of 4.5V to 60V. Exceeding these limits can damage the device.
  2. Output Voltage (VOUT):

    • Set the output voltage using external resistors. The output voltage can be adjusted from 0.8V to 55V.
  3. Switching Frequency (fSW):

    • The switching frequency can be set between 200kHz and 1000kHz using an external resistor. Higher frequencies reduce the size of external components but may increase switching losses.
  4. Quiescent Current (IQ):

    • The quiescent current is typically 90μA. This value is important for low-power applications.
  5. Output Current Limit (ILIM):

    • The maximum output current is limited to 40A. Use external components to adjust this limit if necessary.
  6. Efficiency (η):

    • The efficiency can reach up to 97%. Optimize the design to achieve the highest efficiency by selecting appropriate inductors and capacitors.
  7. Operating Temperature (TOPR):

    • The device operates reliably between -40°C and 125°C. Ensure proper heat dissipation to maintain the operating temperature within this range.
  8. Storage Temperature (TSTG):

    • Store the device between -65°C and 150°C. Avoid exposing the device to extreme temperatures outside this range.
  9. Package Type (PKG):

    • The LTC3865EUH-1#PBF is housed in a 5x6mm package. Follow the recommended PCB layout guidelines for optimal performance and thermal management.
  10. Lead-Free (Pb-Free):

    • The device is lead-free and RoHS compliant. Ensure that your manufacturing process is compatible with lead-free soldering.

Additional Notes:

  • Always refer to the datasheet for detailed information and specific application notes.
  • Proper PCB layout and component selection are crucial for achieving optimal performance and reliability.
(For reference only)

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