IRFB4227

IRFB4227


Specifications
SKU
12598200
Details

BUY IRFB4227 https://www.utsource.net/itm/p/12598200.html

Parameter Symbol Min Typ Max Unit Notes
Continuous Drain Current ID - 110 - A @ Tc = 25掳C, VGS = 10V
Pulse Drain Current IDpeak - 360 - A @ Tc = 25掳C, t = 10渭s, VGS = 10V
Gate-Source Voltage VGS -10 - 20 V -
Drain-Source Breakdown Voltage VDS(BR) 55 - 60 V @ ID = 250渭A, VGS = 0V
Gate-Source Leakage Current IGSS - - 卤100 nA @ VGS = 卤20V, Tj = 25掳C
Drain-Source On-State Resistance RDS(on) - 1.9 - m惟 @ VGS = 10V, ID = 110A, Tj = 25掳C
Gate Charge QG - 130 - nC -
Input Capacitance Ciss - 1850 - pF @ VDS = 15V, f = 1MHz
Output Capacitance Coss - 520 - pF @ VDS = 15V, f = 1MHz
Reverse Transfer Capacitance Crss - 120 - pF @ VDS = 15V, f = 1MHz
Thermal Resistance, Junction to Case R胃JC - 0.55 - 掳C/W -
Operating Junction Temperature Tj -55 - 175 掳C -
Storage Temperature Range Tstg -55 - 175 掳C -

Instructions for Use:

  1. Mounting:

    • Ensure proper heat sinking to manage thermal resistance and maintain junction temperature within specified limits.
    • Use appropriate mounting hardware to secure the device to the heatsink.
  2. Electrical Connections:

    • Connect the drain (D), source (S), and gate (G) terminals correctly.
    • Ensure the gate-source voltage (VGS) does not exceed the maximum rating of 卤20V.
    • Use short leads to minimize parasitic inductance and capacitance.
  3. Operation:

    • Operate within the continuous drain current (ID) and pulse drain current (IDpeak) ratings to avoid overheating.
    • Monitor the junction temperature (Tj) to ensure it stays within the operating range (-55掳C to 175掳C).
    • For high-frequency applications, consider the gate charge (QG) and capacitances (Ciss, Coss, Crss) to optimize switching performance.
  4. Storage:

    • Store the device in a dry, cool environment within the storage temperature range (-55掳C to 175掳C).
  5. Handling:

    • Handle with care to avoid mechanical damage.
    • Follow ESD (Electrostatic Discharge) precautions to prevent damage to the gate oxide.
  6. Testing:

    • Use appropriate test equipment and methods to verify the parameters and ensure the device is functioning correctly.

By following these guidelines, you can ensure reliable and efficient operation of the IRFB4227 MOSFET.

(For reference only)

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