Details
BUY IRFB4227 https://www.utsource.net/itm/p/12598200.html
| Parameter | Symbol | Min | Typ | Max | Unit | Notes |
|---|---|---|---|---|---|---|
| Continuous Drain Current | ID | - | 110 | - | A | @ Tc = 25掳C, VGS = 10V |
| Pulse Drain Current | IDpeak | - | 360 | - | A | @ Tc = 25掳C, t = 10渭s, VGS = 10V |
| Gate-Source Voltage | VGS | -10 | - | 20 | V | - |
| Drain-Source Breakdown Voltage | VDS(BR) | 55 | - | 60 | V | @ ID = 250渭A, VGS = 0V |
| Gate-Source Leakage Current | IGSS | - | - | 卤100 | nA | @ VGS = 卤20V, Tj = 25掳C |
| Drain-Source On-State Resistance | RDS(on) | - | 1.9 | - | m惟 | @ VGS = 10V, ID = 110A, Tj = 25掳C |
| Gate Charge | QG | - | 130 | - | nC | - |
| Input Capacitance | Ciss | - | 1850 | - | pF | @ VDS = 15V, f = 1MHz |
| Output Capacitance | Coss | - | 520 | - | pF | @ VDS = 15V, f = 1MHz |
| Reverse Transfer Capacitance | Crss | - | 120 | - | pF | @ VDS = 15V, f = 1MHz |
| Thermal Resistance, Junction to Case | R胃JC | - | 0.55 | - | 掳C/W | - |
| Operating Junction Temperature | Tj | -55 | - | 175 | 掳C | - |
| Storage Temperature Range | Tstg | -55 | - | 175 | 掳C | - |
Instructions for Use:
Mounting:
- Ensure proper heat sinking to manage thermal resistance and maintain junction temperature within specified limits.
- Use appropriate mounting hardware to secure the device to the heatsink.
Electrical Connections:
- Connect the drain (D), source (S), and gate (G) terminals correctly.
- Ensure the gate-source voltage (VGS) does not exceed the maximum rating of 卤20V.
- Use short leads to minimize parasitic inductance and capacitance.
Operation:
- Operate within the continuous drain current (ID) and pulse drain current (IDpeak) ratings to avoid overheating.
- Monitor the junction temperature (Tj) to ensure it stays within the operating range (-55掳C to 175掳C).
- For high-frequency applications, consider the gate charge (QG) and capacitances (Ciss, Coss, Crss) to optimize switching performance.
Storage:
- Store the device in a dry, cool environment within the storage temperature range (-55掳C to 175掳C).
Handling:
- Handle with care to avoid mechanical damage.
- Follow ESD (Electrostatic Discharge) precautions to prevent damage to the gate oxide.
Testing:
- Use appropriate test equipment and methods to verify the parameters and ensure the device is functioning correctly.
By following these guidelines, you can ensure reliable and efficient operation of the IRFB4227 MOSFET.
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