Details

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BUY BLD128DFP https://www.utsource.net/itm/p/12598210.html

Parameter	Symbol	Min	Typical	Max	Unit
Supply Voltage	Vcc	4.5	5.0	5.5	V
Operating Temperature	Toper	-40	-	85	°C
Storage Temperature	Tstg	-65	-	150	°C
Output Current	Iout	-	2.0	3.0	A
Quiescent Current	Iq	-	0.1	0.5	mA
Shutdown Current	Isd	-	0.01	0.05	μA
Load Regulation	ΔVout/ΔIout	-	0.5%	1.0%	%
Line Regulation	ΔVout/ΔVin	-	0.2%	0.5%	%
Dropout Voltage	Vdo	-	0.3	0.5	V
Ripple Rejection	Rr	50	70	90	dB (120Hz)
Thermal Resistance	θja	-	45	60	°C/W

Instructions for BLD128DFP

1. Supply Voltage:

   • Ensure the supply voltage is within the range of 4.5V to 5.5V to avoid damage or improper operation.

2. Operating Temperature:

   • The device can operate between -40°C and 85°C. Avoid exposing the device to temperatures outside this range.

3. Storage Temperature:

   • Store the device in an environment where the temperature ranges from -65°C to 150°C to prevent degradation.

4. Output Current:

   • The typical output current is 2.0A, with a maximum of 3.0A. Do not exceed the maximum current rating to avoid overheating or damage.

5. Quiescent Current:

   • The quiescent current is typically 0.1mA and should not exceed 0.5mA. This is the current consumed by the device when no load is applied.

6. Shutdown Current:

   • When the device is in shutdown mode, the current consumption should be around 0.01μA and should not exceed 0.05μA.

7. Load Regulation:

   • The load regulation is the change in output voltage due to changes in load current. It should be within 0.5% to 1.0%.

8. Line Regulation:

   • The line regulation is the change in output voltage due to changes in input voltage. It should be within 0.2% to 0.5%.

9. Dropout Voltage:

   • The dropout voltage is the minimum difference between the input and output voltages required to maintain regulation. It is typically 0.3V and should not exceed 0.5V.

10. Ripple Rejection:

    • The ripple rejection is the ability of the device to suppress input voltage variations. It should be between 50dB and 90dB at 120Hz.

11. Thermal Resistance:

    • The thermal resistance from junction to ambient (θja) is typically 45°C/W and should not exceed 60°C/W. Ensure proper heat dissipation to avoid overheating.

12. Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components. Use proper ESD protection measures.

13. Mounting:

    • Follow the recommended PCB layout guidelines to ensure optimal performance and thermal management. Proper mounting and soldering techniques are crucial for reliable operation.

(For reference only)