Details
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| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | Operating | 2.0 | - | 5.5 | V |
| Input Low Voltage | VIL | VCC = 4.5V to 5.5V | - | - | 1.5 | V |
| Input High Voltage | VIH | VCC = 4.5V to 5.5V | 3.5 | - | - | V |
| Output Low Voltage | VOL | IOL = 8 mA, VCC = 4.5V to 5.5V | 0.0 | - | 0.4 | V |
| Output High Voltage | VOH | IOH = -0.4 mA, VCC = 4.5V to 5.5V | 2.4 | - | VCC | V |
| Propagation Delay Time (Typical) | tpd | VCC = 5V, TA = 25掳C | - | 4.8 | - | ns |
| Power Dissipation | PD | Continuous | - | - | 100 | mW |
| Operating Temperature Range | TA | - | -40 | - | 125 | 掳C |
| Storage Temperature Range | TSTG | - | -65 | - | 150 | 掳C |
Instructions for Using MC74ACT32N:
Power Supply:
- Ensure the supply voltage (VCC) is within the range of 2.0V to 5.5V.
- Connect the ground (GND) pin to a stable reference ground.
Input Signals:
- Input signals should be within the valid logic levels:
- Low level (VIL): 0V to 1.5V
- High level (VIH): 3.5V to VCC
- Input signals should be within the valid logic levels:
Output Signals:
- The output will drive loads with the following characteristics:
- Low level (VOL): 0V to 0.4V when sourcing up to 8mA
- High level (VOH): 2.4V to VCC when sinking up to 0.4mA
- The output will drive loads with the following characteristics:
Propagation Delay:
- The typical propagation delay (tpd) is 4.8ns at VCC = 5V and TA = 25掳C. Ensure your design accounts for this delay.
Temperature Considerations:
- The device can operate over a temperature range from -40掳C to 125掳C.
- Store the device in an environment between -65掳C and 150掳C.
Power Dissipation:
- The maximum power dissipation (PD) is 100mW. Ensure adequate heat dissipation if operating near this limit.
Handling Precautions:
- Handle the device with care to avoid static damage.
- Follow proper soldering techniques to prevent thermal stress.
Pin Configuration:
- Refer to the datasheet for the specific pin configuration and ensure correct connections.
Testing:
- Test the device under specified conditions to verify its functionality before integrating it into a larger system.
For detailed information, refer to the official datasheet provided by the manufacturer.
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