Details
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| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Input Voltage | VCC | Operating | 4.5 | 5 | 5.5 | V |
| Input Current (High) | IIH | VI = VCC | - | 1 | 20 | 渭A |
| Input Current (Low) | IIL | VI = 0V | -1000 | -10 | -1 | 渭A |
| Output Voltage (High) | VOH | IO = -0.4mA | 2.4 | 2.7 | 3.5 | V |
| Output Voltage (Low) | VOL | IO = 16mA | 0 | 0.4 | 0.5 | V |
| Propagation Delay Time | tpd | VCC = 5V, VI = 0V to VCC | - | 10 | 25 | ns |
| Power Dissipation | PD | Continuous | - | - | 100 | mW |
| Operating Temperature | TA | Commercial | 0 | - | 70 | 掳C |
| Storage Temperature | TSTG | -65 | - | 150 | 掳C |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (VCC) is within the specified range of 4.5V to 5.5V.
- Connect the ground (GND) pin to a stable 0V reference.
Input Signals:
- Apply input signals within the valid range (0V to VCC).
- Ensure that the input current does not exceed the maximum ratings to avoid damage to the device.
Output Handling:
- The output can drive loads up to 16mA when low and sink up to 0.4mA when high.
- Use appropriate pull-up or pull-down resistors if necessary to ensure proper logic levels.
Propagation Delay:
- Consider the propagation delay time (tpd) in your timing calculations to ensure reliable operation.
Temperature:
- Operate the device within the specified temperature range to avoid thermal stress and potential failure.
- Store the device in an environment where the temperature does not exceed the storage limits.
Handling:
- Handle the device with care to avoid static discharge, which can damage the internal components.
- Follow standard ESD (Electrostatic Discharge) precautions during handling and assembly.
Mounting:
- Ensure proper mounting and soldering techniques to avoid mechanical stress on the pins and the device itself.
- Use a heat sink if necessary to manage power dissipation, especially in high-power applications.
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