Details

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BUY TLX3232T https://www.utsource.net/itm/p/12598394.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Input Voltage	VIN	4.5	-	18	V	Operating input voltage range
Output Voltage	VOUT	-	3.3	-	V	Fixed output voltage
Output Current	IOUT	-	300	-	mA	Maximum continuous output current
Quiescent Current	IQ	-	10	-	渭A	Typical quiescent current
Dropout Voltage	VDROP	-	1.2	-	V	Typical dropout voltage
Load Regulation	-	-	0.5	-	%	Load regulation over specified range
Line Regulation	-	-	0.1	-	%	Line regulation over specified range
Ripple Rejection	-	-	70	-	dB	Power supply rejection ratio
Operating Temperature	TOP	-40	-	125	掳C	Operating temperature range
Storage Temperature	TSTG	-65	-	150	掳C	Storage temperature range
Package Type	-	-	-	-	TO-252	Package type

Instructions for Use

1. Input Voltage:

   • Ensure the input voltage is within the specified range (4.5V to 18V) to avoid damage to the device.

2. Output Voltage:

   • The TLX3232T provides a fixed output voltage of 3.3V. No external components are required to set this voltage.

3. Output Current:

   • The maximum continuous output current is 300mA. Do not exceed this limit to prevent overheating or damage.

4. Quiescent Current:

   • The typical quiescent current is 10渭A, which helps in maintaining low power consumption during operation.

5. Dropout Voltage:

   • The typical dropout voltage is 1.2V. This means the input voltage must be at least 1.2V higher than the output voltage to maintain regulation.

6. Load and Line Regulation:

   • The load regulation is 0.5% and the line regulation is 0.1%, ensuring stable output voltage under varying load and input conditions.

7. Ripple Rejection:

   • The power supply rejection ratio (PSRR) is 70dB, effectively reducing input ripple and noise on the output.

8. Operating and Storage Temperature:

   • The device can operate within a temperature range of -40掳C to 125掳C and can be stored between -65掳C and 150掳C.

9. Package Type:

   • The TLX3232T is available in a TO-252 package, which is suitable for surface mount applications.

10. Mounting and Handling:

    • Follow standard surface mount technology (SMT) guidelines for mounting the device. Avoid excessive heat and mechanical stress during soldering and handling.

11. Capacitors:

    • Use appropriate input and output capacitors as recommended in the datasheet to ensure stability and reduce noise.

12. Thermal Management:

    • Ensure adequate heat dissipation if operating near the maximum output current to prevent thermal shutdown.

13. Electrostatic Discharge (ESD) Protection:

    • Handle the device with ESD precautions to avoid damage from static electricity.

(For reference only)