Details

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BUY 7MBP160VCA060-51 https://www.utsource.net/itm/p/12598445.html

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Rated Voltage	VDSS	-	160	-	V
Continuous Drain Current	ID	-	7	-	A	Tc = 25°C
Continuous Drain Current	ID	-	4.9	-	A	Tc = 85°C
Peak Pulse Current	Ipp	-	35	-	A	t = 10 μs, Ipp ≤ 5 × ID
Gate-Source Voltage	VGS	-10	0	10	V
Gate Charge	Qg	-	10	-	nC	VGS = 10 V, IDS = 7 A
Total Gate Charge	Qgt	-	16	-	nC	VGS = 10 V, IDS = 7 A
Input Capacitance	Ciss	-	330	-	pF	VDS = 160 V, VGS = 0 V
Output Capacitance	Coss	-	130	-	pF	VDS = 160 V, VGS = 0 V
Reverse Transfer Capacitance	Crss	-	80	-	pF	VDS = 160 V, VGS = 0 V
RDS(on)	RDS(on)	-	0.06	-	Ω	VGS = 10 V, ID = 7 A
Turn-on Delay Time	td(on)	-	25	-	ns	VGS = 10 V, IDS = 7 A, RL = 5 Ω
Rise Time	tr	-	20	-	ns	VGS = 10 V, IDS = 7 A, RL = 5 Ω
Turn-off Delay Time	td(off)	-	15	-	ns	VGS = 10 V, IDS = 7 A, RL = 5 Ω
Fall Time	tf	-	10	-	ns	VGS = 10 V, IDS = 7 A, RL = 5 Ω
Power Dissipation	PD	-	200	-	W	Tc = 25°C
Junction Temperature	TJ	-55	-	175	°C
Storage Temperature	Tstg	-55	-	150	°C

Instructions for Use:

1. Operating Conditions:

   • Ensure that the operating voltage (VDS) does not exceed the rated voltage (160 V).
   • The continuous drain current (ID) should not exceed 7 A at 25°C or 4.9 A at 85°C.
   • The peak pulse current (Ipp) should be limited to 35 A for pulses of 10 μs duration.

2. Gate Drive:

   • Apply gate-source voltage (VGS) within the range of -10 V to 10 V.
   • Ensure the gate charge (Qg) is considered when designing the gate drive circuit.

3. Thermal Management:

   • Maintain the junction temperature (TJ) below 175°C to avoid thermal damage.
   • Use appropriate heat sinks or cooling methods to manage power dissipation (PD).

4. Capacitance Considerations:

   • Account for input capacitance (Ciss), output capacitance (Coss), and reverse transfer capacitance (Crss) in high-frequency applications.

5. Switching Characteristics:

   • Optimize switching times (td(on), tr, td(off), tf) by adjusting gate resistance (RL) and ensuring proper gate drive.

6. Storage:

   • Store the device in a dry environment with temperatures between -55°C and 150°C.

7. Handling:

   • Handle the device with care to avoid static discharge and physical damage.
   • Follow ESD (Electrostatic Discharge) precautions during handling and installation.

(For reference only)