Details

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BUY 74HCT175 https://www.utsource.net/itm/p/12598602.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	-	2.0	-	6.0	V
Input Low Voltage	VIL	IL = -0.4 mA	0.0	-	0.8	V
Input High Voltage	VIH	IH = 0.4 mA	2.0	-	VCC	V
Output Low Voltage	VOL	IOL = 4 mA	0.0	-	0.4	V
Output High Voltage	VOH	IOH = -0.4 mA	2.4	-	VCC - 0.5	V
Propagation Delay Time	tpd	VCC = 4.5 V, TA = 25掳C	-	13	-	ns
Power Dissipation per Package	PTOT	-	-	-	340	mW
Operating Temperature Range	TA	-	-40	-	85	掳C

Instructions for Using 74HCT175:

1. Supply Voltage (V_CC):

   • Ensure the supply voltage is within the range of 2.0 V to 6.0 V.
   • Connect V_CC to the positive power supply and GND to the ground.

2. Input Signals:

   • For a valid low input, ensure the voltage is between 0.0 V and 0.8 V.
   • For a valid high input, ensure the voltage is between 2.0 V and V_CC.

3. Output Signals:

   • When the output is low, the voltage will be between 0.0 V and 0.4 V.
   • When the output is high, the voltage will be between 2.4 V and V_CC - 0.5 V.

4. Propagation Delay (t_pd):

   • The typical propagation delay time is 13 ns at V_CC = 4.5 V and T_A = 25掳C.
   • This value can vary with different operating conditions.

5. Power Dissipation:

   • The maximum power dissipation for the package is 340 mW.
   • Ensure proper heat dissipation if operating near this limit.

6. Operating Temperature:

   • The device is designed to operate within a temperature range of -40掳C to 85掳C.
   • Avoid exposing the device to temperatures outside this range to prevent damage.

7. Handling Precautions:

   • Handle the device with care to avoid static damage.
   • Use appropriate ESD protection when handling and soldering the device.

8. Pin Configuration:

   • Refer to the pinout diagram provided in the datasheet to correctly connect the device.
   • Ensure all inputs and outputs are connected as required for your application.

9. Storage:

   • Store the device in a dry, cool place to prevent moisture damage.
   • Follow recommended storage practices to maintain device integrity.

(For reference only)