Details

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BUY til311 https://www.utsource.net/itm/p/12598615.html

Parameter	Symbol	Min	Typ	Max	Unit
Forward Current	IF	-	20	50	mA
Peak Forward Current	Ifsm	-	-	100	mA
Reverse Voltage	VR	-	-	5	V
Forward Voltage	VF	1.1	1.4	1.7	V
Reverse Current	IR	-	100	500	nA
Rise Time	tr	-	10	20	ns
Fall Time	tf	-	10	20	ns
Operating Temperature	Topr	-40	-	85	掳C
Storage Temperature	Tstg	-40	-	125	掳C

Instructions for Use:

1. Forward Current (IF):

   • The typical operating current is 20 mA, with a maximum of 50 mA to avoid damage.
   • Ensure that the peak forward current does not exceed 100 mA to prevent overheating.

2. Reverse Voltage (VR):

   • The device can withstand up to 5V in reverse bias without damage.
   • Avoid exceeding this voltage to prevent breakdown.

3. Forward Voltage (VF):

   • The forward voltage drop across the diode is typically between 1.1V and 1.7V.
   • This value should be considered when designing the circuit to ensure proper operation.

4. Reverse Current (IR):

   • The reverse leakage current is typically 100 nA at room temperature and can increase to 500 nA at higher temperatures.
   • This should be accounted for in low-current applications.

5. Rise and Fall Time (tr, tf):

   • The rise and fall times are both typically around 10 ns, with a maximum of 20 ns.
   • These values are important for high-speed switching applications.

6. Operating Temperature (Topr):

   • The device is designed to operate within a temperature range of -40掳C to 85掳C.
   • Ensure that the ambient temperature remains within these limits to maintain reliable performance.

7. Storage Temperature (Tstg):

   • The device can be stored in temperatures ranging from -40掳C to 125掳C.
   • Avoid exposing the device to extreme temperatures outside this range to prevent damage.

8. Handling Precautions:

   • Handle the device with care to avoid static discharge, which can damage the internal components.
   • Use appropriate ESD protection measures during handling and installation.

9. Mounting:

   • Ensure that the device is securely mounted on the PCB to prevent mechanical stress.
   • Follow recommended soldering profiles to avoid thermal damage during assembly.

(For reference only)