2SB561

2SB561


Specifications
SKU
12599467
Details

BUY 2SB561 https://www.utsource.net/itm/p/12599467.html

Parameter Symbol Conditions Min Typ Max Unit
Collector-Emitter Voltage VCE - - - 80 V
Emitter-Base Voltage VEB - - - 5 V
Collector Current IC - - 150 300 mA
Base Current IB - - 15 30 mA
Power Dissipation PT TA = 25掳C - - 625 mW
Junction Temperature TJ - - - 150 掳C
Storage Temperature Range TSTG - -40 - 150 掳C

Instructions for Use:

  1. Mounting and Handling:

    • Handle the 2SB561 with care to avoid mechanical damage.
    • Ensure that the device is mounted on a suitable heatsink if operating at high power levels.
  2. Electrical Connections:

    • Connect the collector (C) to the positive supply or load.
    • Connect the emitter (E) to the negative supply or ground.
    • Connect the base (B) to the control circuit.
  3. Operating Conditions:

    • Do not exceed the maximum ratings listed in the table.
    • Ensure that the junction temperature does not exceed 150掳C.
    • For reliable operation, keep the ambient temperature within the storage temperature range.
  4. Storage:

    • Store the device in a dry, cool place away from direct sunlight and corrosive environments.
    • Avoid exposure to high humidity and extreme temperatures.
  5. Testing:

    • Before installing the device, test it using a multimeter or transistor tester to ensure it meets the specified parameters.
    • Follow standard testing procedures to avoid damaging the device.
  6. Soldering:

    • Use a soldering iron with a temperature no higher than 300掳C.
    • Solder each lead for no more than 3 seconds to prevent thermal damage to the device.
  7. Dissipation Management:

    • If the device is expected to dissipate significant power, use a heatsink to maintain the junction temperature within safe limits.
    • Ensure adequate ventilation around the device to facilitate heat dissipation.
  8. Protective Measures:

    • Use anti-static precautions when handling the device to prevent electrostatic discharge (ESD) damage.
    • Ground all equipment and work surfaces before handling the device.
(For reference only)

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