Details
BUY 2SB561 https://www.utsource.net/itm/p/12599467.html
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Collector-Emitter Voltage | VCE | - | - | - | 80 | V |
| Emitter-Base Voltage | VEB | - | - | - | 5 | V |
| Collector Current | IC | - | - | 150 | 300 | mA |
| Base Current | IB | - | - | 15 | 30 | mA |
| Power Dissipation | PT | TA = 25掳C | - | - | 625 | mW |
| Junction Temperature | TJ | - | - | - | 150 | 掳C |
| Storage Temperature Range | TSTG | - | -40 | - | 150 | 掳C |
Instructions for Use:
Mounting and Handling:
- Handle the 2SB561 with care to avoid mechanical damage.
- Ensure that the device is mounted on a suitable heatsink if operating at high power levels.
Electrical Connections:
- Connect the collector (C) to the positive supply or load.
- Connect the emitter (E) to the negative supply or ground.
- Connect the base (B) to the control circuit.
Operating Conditions:
- Do not exceed the maximum ratings listed in the table.
- Ensure that the junction temperature does not exceed 150掳C.
- For reliable operation, keep the ambient temperature within the storage temperature range.
Storage:
- Store the device in a dry, cool place away from direct sunlight and corrosive environments.
- Avoid exposure to high humidity and extreme temperatures.
Testing:
- Before installing the device, test it using a multimeter or transistor tester to ensure it meets the specified parameters.
- Follow standard testing procedures to avoid damaging the device.
Soldering:
- Use a soldering iron with a temperature no higher than 300掳C.
- Solder each lead for no more than 3 seconds to prevent thermal damage to the device.
Dissipation Management:
- If the device is expected to dissipate significant power, use a heatsink to maintain the junction temperature within safe limits.
- Ensure adequate ventilation around the device to facilitate heat dissipation.
Protective Measures:
- Use anti-static precautions when handling the device to prevent electrostatic discharge (ESD) damage.
- Ground all equipment and work surfaces before handling the device.
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