Details

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BUY DS34LV86TMX/NOPB https://www.utsource.net/itm/p/12599470.html

Parameter	Symbol	Min	Typ	Max	Unit
Supply Voltage	VCC	2.5	-	5.5	V
Operating Temperature	TOP	-40	-	85	掳C
Storage Temperature	TSTG	-65	-	150	掳C
Input Voltage Range	VI	0	-	VCC	V
Output Voltage Range	VO	0	-	VCC	V
Maximum Output Current	IO	-	20	-	mA
Quiescent Current	IQ	0.1	0.5	1.0	渭A
Propagation Delay Time (High to Low)	tPLH	10	20	30	ns
Propagation Delay Time (Low to High)	tPHL	10	20	30	ns
Input Capacitance	CI	-	5	-	pF
Output Capacitance	CO	-	10	-	pF
Maximum Power Dissipation	PD	-	-	350	mW

Instructions for DS34LV86TMX/NOPB

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 2.5V to 5.5V.
   • Use a stable power source to avoid fluctuations that could affect performance.

2. Temperature Considerations:

   • The operating temperature range is from -40掳C to 85掳C.
   • Store the device in an environment with temperatures between -65掳C and 150掳C.

3. Input and Output Voltage:

   • The input voltage (V_I) should be within the range of 0V to V_CC.
   • The output voltage (V_O) will also be within the range of 0V to V_CC.

4. Current Handling:

   • The maximum output current (I_O) is 20mA. Do not exceed this limit to prevent damage.
   • The quiescent current (I_Q) is typically 0.5渭A, but can range from 0.1渭A to 1.0渭A.

5. Propagation Delay:

   • The propagation delay times (t_PLH and t_PHL) are typically 20ns, with a minimum of 10ns and a maximum of 30ns.

6. Capacitance:

   • The input capacitance (C_I) is typically 5pF.
   • The output capacitance (C_O) is typically 10pF.

7. Power Dissipation:

   • The maximum power dissipation (P_D) is 350mW. Ensure proper heat dissipation to avoid overheating.

8. Handling and Storage:

   • Handle the device with care to avoid static discharge, which can damage the component.
   • Store the device in a dry, cool place to prevent moisture damage.

9. Mounting:

   • Follow the recommended soldering profile to ensure reliable connections.
   • Avoid excessive thermal stress during soldering.

10. Testing:

    • Test the device under controlled conditions to verify its performance before integrating it into a larger system.

(For reference only)