Details

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BUY ADM691AN https://www.utsource.net/itm/p/12599479.html

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Input Voltage Range	VIN	2.7	-	5.5	V	-
Output Voltage	VOUT	-	3.3	-	V	Fixed output
Output Current	IOUT	-	100	150	mA	Continuous operation
Dropout Voltage	VDROP	-	0.4	-	V	IOUT = 150 mA
Quiescent Current	IQ	-	0.1	-	mA	VOUT = 3.3 V
Load Regulation	-	-	0.1	-	%	IOUT = 0 to 150 mA
Line Regulation	-	-	0.1	-	%	VIN = 2.7 to 5.5 V
Power Supply Rejection Ratio (PSRR)	-	-	70	-	dB	f = 100 Hz
Thermal Shutdown Temperature	TSD	-	160	-	掳C	-
Operating Junction Temperature	TJ	-40	-	125	掳C	-
Storage Temperature Range	TSTORAGE	-40	-	150	掳C	-

Instructions for Use

1. Input Connection:

   • Connect the input voltage (V_IN) to the VIN pin.
   • Ensure the input voltage is within the specified range (2.7 V to 5.5 V).

2. Output Connection:

   • Connect the load to the V_OUT pin.
   • The output voltage is fixed at 3.3 V.

3. Ground Connection:

   • Connect the ground (GND) pin to the common ground of the system.

4. Capacitors:

   • Place a 1 渭F ceramic capacitor between VIN and GND as close as possible to the device.
   • Place a 1 渭F ceramic capacitor between V_OUT and GND as close as possible to the device.

5. Thermal Considerations:

   • Ensure adequate heat dissipation if operating at high output currents or in high ambient temperatures.
   • The thermal shutdown feature will activate if the junction temperature exceeds 160掳C.

6. Operating Temperature:

   • The device is designed to operate within a junction temperature range of -40掳C to 125掳C.
   • Store the device in an environment with a temperature range of -40掳C to 150掳C.

7. Handling Precautions:

   • Handle the device with care to avoid damage from electrostatic discharge (ESD).
   • Follow proper soldering techniques to prevent thermal shock and mechanical stress.

8. Testing:

   • Before final assembly, test the device under typical operating conditions to ensure it meets the required specifications.

(For reference only)