FQP13N50C

FQP13N50C


Specifications
SKU
12599481
Details

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Parameter Symbol Min Typ Max Unit Conditions
Drain-Source Voltage VDS - 500 - V
Gate-Source Voltage VGS -20 - 20 V
Continuous Drain Current ID - 13 - A TC = 25掳C
Pulse Drain Current IDpeak - 45 - A tp = 10 ms, IG = 0.5 A
Power Dissipation PTOT - - 150 W TC = 25掳C
Junction Temperature TJ - - 175 掳C
Storage Temperature Range TSTG -65 - 150 掳C
Total Gate Charge QG - 90 - nC
Input Capacitance Ciss - 1300 - pF VDS = 25 V, f = 1 MHz
Output Capacitance Coss - 100 - pF VDS = 25 V, f = 1 MHz
Reverse Transfer Capacitance Crss - 20 - pF VDS = 25 V, f = 1 MHz
Threshold Gate Voltage VGS(th) 2.0 4.0 6.0 V ID = 250 渭A, TA = 25掳C
On-State Resistance RDS(on) - 1.8 - VGS = 10 V, ID = 13 A, TA = 25掳C

Instructions for Use:

  1. Handling Precautions:

    • Handle the FQP13N50C with care to avoid static discharge damage.
    • Ensure that the device is not exposed to temperatures outside its storage range.
  2. Mounting:

    • Use appropriate heat sinks to manage power dissipation and keep the junction temperature within safe limits.
    • Ensure proper mechanical alignment during mounting to avoid stress on the leads.
  3. Electrical Connections:

    • Connect the gate to a low impedance source to minimize noise and ensure stable operation.
    • Use bypass capacitors close to the power supply pins to filter out high-frequency noise.
  4. Thermal Management:

    • Monitor the junction temperature to prevent overheating, especially under continuous load conditions.
    • Use thermal paste between the device and the heat sink to improve thermal conductivity.
  5. Gate Drive:

    • Apply gate voltages within the specified range to avoid damaging the device.
    • Ensure the gate drive circuit can provide sufficient current to charge and discharge the gate capacitance quickly.
  6. Overcurrent Protection:

    • Implement overcurrent protection to prevent damage from excessive drain current.
    • Consider using a current-limiting resistor or a current-sensing circuit.
  7. Storage and Transportation:

    • Store the device in a dry, cool place away from direct sunlight.
    • Follow ESD (Electrostatic Discharge) guidelines during transportation and handling.
(For reference only)

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