Details

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BUY SN74HCT04N https://www.utsource.net/itm/p/12600148.html

Parameter	Symbol	Conditions	Min	Typical	Max	Unit
Supply Voltage	VCC	Operating	2.0	-	6.0	V
Input Low Voltage	VIL	VCC = 4.5V to 5.5V	0.8	-	-	V
Input High Voltage	VIH	VCC = 4.5V to 5.5V	-	-	2.0	V
Output Low Voltage	VOL	IOL = 4 mA, VCC = 4.5V to 5.5V	0.25	-	0.4	V
Output High Voltage	VOH	IOH = -0.4 mA, VCC = 4.5V to 5.5V	2.4	-	2.7	V
Input Current (Low)	IIL	VIL = 0V, VCC = 4.5V to 5.5V	-1.0	-	-0.4	渭A
Input Current (High)	IIH	VIH = VCC, VCC = 4.5V to 5.5V	0.1	-	20	渭A
Output Current (Sink)	IOL	VOL = 0.4V, VCC = 4.5V to 5.5V	8	-	32	mA
Output Current (Source)	IOH	VOH = 2.4V, VCC = 4.5V to 5.5V	-8	-	-4	mA
Propagation Delay Time	tpd	VCC = 4.5V to 5.5V, TA = 25掳C	7	-	15	ns
Power Dissipation	Ptot	Continuous, Ambient Temperature	-	-	500	mW

Instructions for Use:

1. Supply Voltage (V_CC):

   • Ensure the supply voltage is within the range of 2.0V to 6.0V to avoid damage to the device.

2. Input Voltages (V_IL, V_IH):

   • For reliable operation, input low voltages should be below 0.8V and input high voltages should be above 2.0V when V_CC is between 4.5V and 5.5V.

3. Output Voltages (V_OL, V_OH):

   • The output low voltage should not exceed 0.4V when sinking 4mA, and the output high voltage should be at least 2.4V when sourcing -0.4mA.

4. Current Ratings:

   • Do not exceed the maximum output current ratings of 32mA (sink) and 4mA (source) to prevent damage to the device.
   • Input currents should be within the specified ranges to ensure proper operation.

5. Propagation Delay (t_pd):

   • The propagation delay time is the time it takes for the output to change state after the input changes. It should be within 7 to 15 nanoseconds under typical operating conditions.

6. Power Dissipation:

   • The total power dissipation should not exceed 500mW to avoid overheating and potential damage to the device.

7. Handling:

   • Handle the SN74HCT04N with care to avoid static damage. Use proper ESD protection measures.

8. Mounting:

   • Ensure proper mounting and soldering techniques to avoid mechanical stress on the device.

9. Storage:

   • Store the device in a dry, cool environment to prevent moisture damage.

(For reference only)