Details

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BUY TL16C550CFN https://www.utsource.net/itm/p/12600314.html

Parameter	Description	Min	Typ	Max	Unit
Supply Voltage (VCC)	Operating voltage range	4.75	-	5.25	V
Operating Temperature Range	Temperature range for normal operation	-40	-	85	掳C
Storage Temperature Range	Temperature range for storage	-65	-	150	掳C
Input Voltage (VIH)	High-level input voltage	2.0	-	5.25	V
Input Voltage (VIL)	Low-level input voltage	0	-	0.8	V
Output Voltage (VOH)	High-level output voltage	2.4	-	5.0	V
Output Voltage (VOL)	Low-level output voltage	0	-	0.4	V
Input Current (IIH)	High-level input current	-1.0	-	-	渭A
Input Current (IIL)	Low-level input current	-20	-	-	渭A
Output Current (IOH)	High-level output current	-	-	-4	mA
Output Current (IOL)	Low-level output current	-	-	16	mA
Power Consumption	Typical power consumption at 5V	-	25	-	mW
Data Rate	Maximum data rate	-	-	1.5	Mbps

Instructions for Use:

1. Power Supply:

   • Ensure that the supply voltage (VCC) is within the specified range of 4.75V to 5.25V.
   • Connect the ground (GND) pin to a stable reference ground.

2. Temperature Considerations:

   • Operate the device within the temperature range of -40掳C to 85掳C for optimal performance.
   • Store the device in an environment with temperatures between -65掳C and 150掳C.

3. Input Signals:

   • Apply high-level input voltages (VIH) within the range of 2.0V to 5.25V.
   • Apply low-level input voltages (VIL) within the range of 0V to 0.8V.
   • Ensure that the input currents (IIH and IIL) do not exceed -1.0渭A and -20渭A, respectively.

4. Output Signals:

   • The high-level output voltage (VOH) should be within the range of 2.4V to 5.0V.
   • The low-level output voltage (VOL) should be within the range of 0V to 0.4V.
   • The output currents (IOH and IOL) should not exceed -4mA and 16mA, respectively.

5. Data Transmission:

   • The maximum data rate supported by the device is 1.5 Mbps.

6. Power Consumption:

   • The typical power consumption at 5V is 25mW. Ensure that the power supply can handle this load.

7. Handling and Storage:

   • Handle the device with care to avoid static damage.
   • Store the device in a dry and cool environment to prevent degradation.

8. Schematic and Layout:

   • Refer to the datasheet for detailed pin configurations and recommended PCB layout guidelines to ensure proper operation and signal integrity.

9. Testing:

   • Perform initial testing under controlled conditions to verify the functionality of the device before integrating it into a larger system.

(For reference only)