Details

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BUY AM26C31IPWR https://www.utsource.net/itm/p/12600325.html

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Supply Voltage	VCC	4.75	5.0	5.25	V	-
Input Voltage (High)	VIH	3.15	-	5.25	V	-
Input Voltage (Low)	VIL	0	-	2.1	V	-
Output Voltage (High)	VOH	2.4	-	5.25	V	IOL = 0.4 mA
Output Voltage (Low)	VOL	0	-	0.5	V	IOL = 16 mA
Propagation Delay Time	tpd	-	18	36	ns	VCC = 5V, TA = 25掳C
Skew	tskew	-	5	10	ns	VCC = 5V, TA = 25掳C
Operating Temperature	TA	-40	-	85	掳C	-
Storage Temperature	TSTG	-65	-	150	掳C	-
Maximum Junction Temperature	TJ(max)	-	-	150	掳C	-

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the specified range of 4.75V to 5.25V.
   • Connect the ground (GND) pin to a stable reference point.

2. Input Signals:

   • For a valid high input (V_IH), the voltage should be between 3.15V and 5.25V.
   • For a valid low input (V_IL), the voltage should be between 0V and 2.1V.

3. Output Signals:

   • The output voltage (V_OH) will be between 2.4V and 5.25V when the output is high.
   • The output voltage (V_OL) will be between 0V and 0.5V when the output is low.

4. Propagation Delay:

   • The propagation delay time (t_pd) is typically 18ns with a maximum of 36ns at V_CC = 5V and ambient temperature (TA) = 25掳C.

5. Skew:

   • The skew (t_skew) is typically 5ns with a maximum of 10ns under the same conditions as propagation delay.

6. Temperature Considerations:

   • The device can operate over a temperature range from -40掳C to 85掳C.
   • Store the device in an environment where the temperature does not exceed -65掳C to 150掳C.
   • Do not exceed the maximum junction temperature (T_J(max)) of 150掳C during operation.

7. Handling:

   • Handle the device with care to avoid damage from electrostatic discharge (ESD).
   • Follow proper soldering techniques to ensure reliable connections.

8. Mounting:

   • Ensure proper mounting on the PCB to maintain thermal performance and mechanical stability.
   • Use appropriate cooling solutions if operating in high-temperature environments or under high power conditions.

9. Testing:

   • Verify the functionality of the device using a test setup that mimics the intended application conditions.
   • Check for correct voltage levels and signal integrity during testing.

(For reference only)