Details

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BUY SN74HC00AN https://www.utsource.net/itm/p/12600723.html

Parameter	Symbol	Conditions	Min	Typical	Max	Unit
Supply Voltage	VCC	Operating	2.0	-	6.0	V
Input Low Voltage	VIL	-	0.0	-	0.8	V
Input High Voltage	VIH	-	2.0	-	VCC	V
Output Low Voltage	VOL	IOL = 4 mA	0.0	-	0.4	V
Output High Voltage	VOH	IOH = -0.4 mA	VCC - 0.1	-	VCC	V
Propagation Delay Time	tpd	VCC = 4.5 V, fo = 1 MHz	6	-	18	ns
Power Dissipation	Ptot	-	-	-	500	mW
Operating Temperature Range	TA	-	-40	-	85	°C
Storage Temperature Range	TSTG	-	-65	-	150	°C

Instructions for Using SN74HC00AN

1. Supply Voltage (V_CC):

   • Ensure the supply voltage is within the range of 2.0 V to 6.0 V.
   • Avoid exceeding these limits to prevent damage to the device.

2. Input Voltage Levels:

   • For a valid low input, the voltage should be between 0.0 V and 0.8 V.
   • For a valid high input, the voltage should be between 2.0 V and V_CC.

3. Output Voltage Levels:

   • When the output is low, the voltage should not exceed 0.4 V when sourcing 4 mA.
   • When the output is high, the voltage should be at least V_CC - 0.1 V when sinking -0.4 mA.

4. Propagation Delay Time (t_pd):

   • The propagation delay time is the time it takes for a change in input to affect the output.
   • At V_CC = 4.5 V and f_o = 1 MHz, the typical propagation delay is between 6 ns and 18 ns.

5. Power Dissipation (P_tot):

   • The maximum power dissipation is 500 mW. Ensure that the device does not exceed this limit to avoid overheating.

6. Operating Temperature (T_A):

   • The operating temperature range is from -40°C to 85°C. Ensure the device operates within this range to maintain reliability.

7. Storage Temperature (T_STG):

   • The storage temperature range is from -65°C to 150°C. Store the device within this range to prevent damage.

8. Handling and ESD Protection:

   • Handle the device with care to avoid electrostatic discharge (ESD) damage.
   • Use proper ESD protection equipment and techniques when handling the device.

9. Mounting and Soldering:

   • Follow recommended soldering profiles to ensure reliable connections.
   • Avoid excessive heat during soldering to prevent damage to the device.

10. Testing and Verification:

    • After assembly, verify the functionality of the device by testing its inputs and outputs under specified conditions.
    • Use appropriate test equipment and procedures to ensure accurate results.

(For reference only)