Details
BUY P82896T https://www.utsource.net/itm/p/12602746.html
| Parameter | Description | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Supply Voltage (Vcc) | Operating supply voltage range | 4.5 | - | 5.5 | V |
| Output Current (Iout) | Maximum continuous output current | - | 100 | 150 | mA |
| Output Voltage (Vout) | Regulated output voltage | 3.3 | - | - | V |
| Quiescent Current (Iq) | Quiescent current | 1.0 | - | 2.0 | mA |
| Dropout Voltage (Vdo) | Dropout voltage at Iout = 100mA | - | 0.3 | 0.5 | V |
| Load Regulation | Change in output voltage with load current | - | 0.5 | 1.0 | % |
| Line Regulation | Change in output voltage with input voltage | - | 0.1 | 0.3 | % |
| Thermal Shutdown Temperature (TSD) | Temperature at which thermal shutdown occurs | - | 150 | 170 | 掳C |
| Operating Temperature Range (Ta) | Ambient operating temperature range | -40 | - | 85 | 掳C |
| Storage Temperature Range (Tstg) | Temperature range for storage | -65 | - | 150 | 掳C |
Instructions for Use:
Power Supply Connection:
- Connect the input voltage (Vcc) to the IN pin.
- Ensure the input voltage is within the specified range (4.5V to 5.5V).
Output Configuration:
- Connect the OUT pin to the load.
- The regulated output voltage is 3.3V.
Grounding:
- Connect the GND pin to the system ground.
Capacitors:
- Place a 1渭F ceramic capacitor between the IN pin and GND close to the device to ensure stability.
- Optionally, place a 1渭F ceramic capacitor between the OUT pin and GND to improve transient response.
Thermal Management:
- Ensure adequate heat dissipation if the device is operating near its maximum output current.
- The device has built-in thermal shutdown protection to prevent damage from overheating.
Operating Environment:
- Operate the device within the specified ambient temperature range (-40掳C to 85掳C).
- Store the device within the storage temperature range (-65掳C to 150掳C).
Handling Precautions:
- Handle the device with care to avoid damage from electrostatic discharge (ESD).
- Follow proper soldering techniques to avoid thermal stress during assembly.
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