Details
BUY SVF9N90F https://www.utsource.net/itm/p/12602816.html
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | - | 900 | - | V | Maximum voltage between drain and source with gate open |
| Gate-Source Voltage | VGS | -20 | 0 | 20 | V | Maximum voltage between gate and source |
| Continuous Drain Current | ID | - | 9 | - | A | Maximum continuous current through the drain to source |
| Pulse Drain Current | ID(p) | - | 18 | - | A | Maximum pulse current through the drain to source (tp = 10 渭s, fc = 1/1000) |
| Total Power Dissipation | PTOT | - | 130 | - | W | Maximum power dissipation at TC = 25掳C |
| Junction Temperature | TJ | - | - | 175 | 掳C | Maximum operating junction temperature |
| Storage Temperature Range | TSTG | -65 | - | 150 | 掳C | Temperature range for storage and handling |
Instructions for Use:
Handling Precautions:
- Handle the SVF9N90F with care to avoid damage to the leads and body.
- Use proper ESD (Electrostatic Discharge) protection to prevent damage from static electricity.
Mounting:
- Ensure that the mounting surface is clean and flat to ensure good thermal contact.
- Apply a suitable thermal compound or pad to enhance heat dissipation.
Soldering:
- Soldering temperature should not exceed 260掳C for more than 10 seconds.
- Allow the device to cool naturally after soldering.
Operating Conditions:
- Do not exceed the maximum ratings listed in the parameter table.
- Ensure adequate cooling to keep the junction temperature within safe limits, especially during high-power operation.
Gate Drive:
- Use a gate resistor to limit the current and reduce ringing.
- Ensure the gate drive circuit can provide sufficient voltage and current to switch the device on and off quickly.
Storage:
- Store the device in a dry, cool place away from direct sunlight and sources of heat.
- Follow the recommended storage temperature range to avoid damage.
Testing:
- Use appropriate test equipment and procedures to avoid damaging the device.
- Refer to the datasheet for specific test conditions and procedures.
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