MMBZ5V6ALT1G

MMBZ5V6ALT1G

Category: IC Chips

Specifications
Details

BUY MMBZ5V6ALT1G https://www.utsource.net/itm/p/12602880.html

Parameter Symbol Conditions Min Typ Max Unit
Breakdown Voltage VBR I = 1 mA 5.6 V
Maximum Standoff Voltage VRWM 4.3 V
Peak Pulse Current Ipp tp = 8.3 ms, Repetition Rate 1/s 0.6 A
Operating Junction Temperature Range TJ -55 150 °C
Leakage Current IR V = 5.1 V, T = 25°C 1 μA

Instructions for MMBZ5V6ALT1G

  1. Handling Precautions:

    • Handle with care to avoid damage to the component.
    • Use proper ESD (Electrostatic Discharge) protection measures.
  2. Mounting and Soldering:

    • Ensure that the soldering temperature does not exceed the maximum junction temperature.
    • Follow manufacturer guidelines for soldering profiles to prevent thermal shock.
  3. Storage:

    • Store in a dry environment to prevent moisture damage.
    • Keep away from direct sunlight and sources of heat.
  4. Application:

    • Suitable for use in circuits where transient voltage suppression is required.
    • Verify that the operating conditions do not exceed the maximum ratings provided.
  5. Testing:

    • Test the device parameters periodically to ensure reliability.
    • Use appropriate test equipment to measure leakage current and breakdown voltage accurately.
(For reference only)

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