SN75175DRG4
Specifications
SKU
12602905
Details
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Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
---|---|---|---|---|---|---|
Supply Voltage | VCC | 4.75 | 5.0 | 5.25 | V | - |
Input Voltage Range | VI | -0.5 | - | 5.5 | V | - |
Output Voltage Range | VO | 0 | - | VCC | V | - |
Output Current (Source) | IOH | - | 16 | - | mA | VO = 2.4V, VCC = 5V |
Output Current (Sink) | IOL | - | 24 | - | mA | VO = 0.4V, VCC = 5V |
Propagation Delay Time | tpd | - | 35 | - | ns | VCC = 5V, VI = 2.0V to 3.0V, VO = 2.0V to 3.0V |
Skew | tskew | - | 5 | - | ns | VCC = 5V, VI = 2.0V to 3.0V, VO = 2.0V to 3.0V |
Power Dissipation | PD | - | - | 625 | mW | TA = 25°C, VCC = 5V |
Operating Temperature Range | TA | -40 | - | 85 | °C | - |
Storage Temperature Range | TSTG | -65 | - | 150 | °C | - |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (VCC) is within the range of 4.75V to 5.25V.
- Connect the ground (GND) pin to the system ground.
Input Signals:
- The input voltage (VI) should be within the range of -0.5V to 5.5V.
- Avoid exceeding these limits to prevent damage to the device.
Output Signals:
- The output voltage (VO) will be between 0V and VCC.
- The output current capabilities are 16mA (source) and 24mA (sink).
Propagation Delay:
- The propagation delay time (tpd) is typically 35ns under standard conditions.
- The skew (tskew) between channels is typically 5ns.
Thermal Management:
- The power dissipation (PD) should not exceed 625mW at 25°C ambient temperature.
- For higher ambient temperatures, ensure adequate heat sinking or cooling.
Temperature Ranges:
- The operating temperature range (TA) is from -40°C to 85°C.
- The storage temperature range (TSTG) is from -65°C to 150°C.
Handling and Storage:
- Store the device in a dry environment to prevent moisture damage.
- Handle with care to avoid static discharge, which can damage the device.
Mounting:
- Follow the recommended PCB layout guidelines to ensure proper thermal performance and signal integrity.
- Ensure all connections are secure and free from solder bridges or shorts.
Testing:
- Test the device under typical operating conditions to verify its functionality.
- Use a multimeter to check for correct voltage levels and continuity.
Compliance:
- Ensure that the device complies with relevant safety and regulatory standards for your application.
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