Details

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BUY PC410L0NIP0F https://www.utsource.net/itm/p/12602922.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Input Voltage	VIN	4.5	-	28	V
Output Voltage	VOUT	-	3.3	-	V	Fixed
Output Current	IOUT	-	-	1	A
Quiescent Current	IQ	-	70	-	渭A
Dropout Voltage	VDROPOUT	-	0.3	-	V @ 1A
Power Dissipation	PD	-	-	1.5	W
Operating Temperature	TOPR	-40	-	125	掳C
Storage Temperature	TSTG	-65	-	150	掳C
Junction Temperature	TJ	-40	-	150	掳C

Instructions for Use:

1. Input Voltage (VIN):

   • Ensure the input voltage is within the range of 4.5V to 28V.
   • The input voltage should be stable and free from excessive noise.

2. Output Voltage (VOUT):

   • The output voltage is fixed at 3.3V. No external components are required to set this voltage.

3. Output Current (IOUT):

   • The maximum continuous output current is 1A. Ensure that the load does not exceed this limit to avoid damage to the device.

4. Quiescent Current (IQ):

   • The quiescent current is typically 70渭A. This is the current consumed by the regulator when no load is applied.

5. Dropout Voltage (VDROPOUT):

   • The dropout voltage is typically 0.3V at 1A output current. This means the input voltage must be at least 0.3V higher than the output voltage to maintain regulation.

6. Power Dissipation (PD):

   • The maximum power dissipation is 1.5W. Ensure adequate heat sinking if the device is operating near this limit to prevent overheating.

7. Operating Temperature (TOPR):

   • The operating temperature range is from -40掳C to 125掳C. Ensure the device is used within this range to maintain reliable operation.

8. Storage Temperature (TSTG):

   • The storage temperature range is from -65掳C to 150掳C. Store the device in a dry, cool place to prevent damage.

9. Junction Temperature (TJ):

   • The junction temperature should not exceed 150掳C. Monitor the temperature to ensure it stays within safe limits.

10. Mounting and Layout:

    • Use a good thermal design to ensure efficient heat dissipation. Place the device away from heat sources and ensure there is adequate airflow around the component.
    • Use short, wide traces for power and ground connections to minimize inductance and resistance.

11. Capacitors:

    • Use a 1渭F ceramic capacitor on the input side and a 1渭F ceramic capacitor on the output side for stability. Place these capacitors as close as possible to the device.

12. Protection:

    • Consider adding overvoltage and overcurrent protection circuits to protect the device from potential faults.

(For reference only)