BYV26E-TAP SOD-57

BYV26E-TAP SOD-57


Specifications
SKU
12602923
Details

BUY BYV26E-TAP SOD-57 https://www.utsource.net/itm/p/12602923.html

Parameter Symbol Min Typ Max Unit Notes
Forward Voltage VF - 1.0 1.3 V @ 20 mA Typical operating condition
Reverse Breakdown Voltage VBR 30 - 45 V @ 1 渭A Reverse breakdown voltage
Reverse Current IR - - 100 nA @ 25掳C Reverse leakage current
Power Dissipation PT - - 200 mW Maximum power dissipation
Operating Junction Temperature TJ -40 - 150 掳C Operating temperature range
Storage Temperature TSTG -65 - 150 掳C Storage temperature range
Thermal Resistance R胃JA - 300 - K/W Junction to ambient
Capacitance CR - 4 - pF @ 1 MHz Reverse capacitance
Rise Time tr - 4 - ns Typical rise time
Fall Time tf - 4 - ns Typical fall time

Instructions for Use:

  1. Mounting:

    • Ensure that the component is mounted on a PCB with proper soldering techniques.
    • Avoid excessive heat during soldering, as it can damage the device.
  2. Handling:

    • Handle the component with care to avoid mechanical stress or damage.
    • Use anti-static precautions to prevent electrostatic discharge (ESD) damage.
  3. Operating Conditions:

    • Ensure that the operating junction temperature (TJ) does not exceed 150掳C.
    • Keep the reverse voltage below the specified maximum (45V) to prevent breakdown.
  4. Power Dissipation:

    • The maximum power dissipation is 200 mW. Ensure adequate heat sinking if operating near this limit.
  5. Storage:

    • Store the component in a dry, cool place within the specified storage temperature range (-65掳C to 150掳C).
  6. Testing:

    • When testing the component, use the specified test conditions to ensure accurate results.
  7. Soldering:

    • Use a soldering iron with a temperature no higher than 300掳C for a duration not exceeding 10 seconds per connection.
  8. Capacitance:

    • The reverse capacitance is 4 pF at 1 MHz, which may affect high-frequency applications.
  9. Timing:

    • The typical rise and fall times are 4 ns, which should be considered in high-speed circuits.
  10. Compliance:

    • Ensure that the component complies with all relevant safety and regulatory standards for your application.
(For reference only)

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