Details
BUY IKCM20L60GA https://www.utsource.net/itm/p/12603231.html
| Parameter | Symbol | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Collector-Emitter Voltage | V CES | - | - | 600 | V |
| Emitter-Collector Voltage | V ECS | - | - | 600 | V |
| Gate-Emitter Voltage | V GES | -15 | - | 15 | V |
| Continuous Collector Current | I C | - | 20 | - | A |
| Pulse Collector Current (t = 10 ms, duty cycle 1/100) | I CM | - | 80 | - | A |
| Power Dissipation | P TOT | - | - | 300 | W |
| Junction Temperature | T J | -55 | - | 175 | 掳C |
| Storage Temperature | T STG | -55 | - | 150 | 掳C |
| Thermal Resistance, Junction to Case | R 胃JC | - | 0.4 | - | K/W |
Instructions for Use:
Mounting:
- Ensure proper heat sinking to maintain junction temperature within specified limits.
- Use a thermal compound between the device and the heat sink for efficient heat dissipation.
Biasing:
- Apply gate-emitter voltage (V GE) within the specified range to avoid damage.
- Use appropriate gate resistors to control turn-on and turn-off times, reducing switching losses.
Current Handling:
- Do not exceed the continuous collector current (I C) or pulse collector current (I CM) ratings.
- For high current applications, consider parallel operation with multiple devices.
Thermal Management:
- Monitor the junction temperature (T J) to ensure it remains below the maximum rating.
- Use forced air cooling or liquid cooling if necessary to manage heat effectively.
Storage:
- Store the device in a dry, cool environment to prevent moisture damage.
- Avoid exposure to temperatures outside the storage temperature range (T STG).
Handling:
- Handle the device with care to avoid mechanical stress.
- Use proper ESD protection to prevent damage from static electricity.
Testing:
- Perform initial testing at reduced power levels to verify correct operation.
- Regularly inspect the device for signs of wear or damage during operation.
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