Details
BUY SN74LS89N https://www.utsource.net/itm/p/12603232.html
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | Operating | 4.75 | 5.0 | 5.25 | V |
| Input Low Voltage | VIL | VCC = 5V | 0.8 | - | - | V |
| Input High Voltage | VIH | VCC = 5V | - | - | 2.0 | V |
| Output Low Voltage | VOL | IL = 16mA | 0.4 | - | - | V |
| Output High Voltage | VOH | IH = -0.4mA | - | - | 2.4 | V |
| Propagation Delay Time | tpd | VCC = 5V, TA = 25°C | - | 35 | - | ns |
| Power Dissipation | PD | Per Package | - | - | 500 | mW |
| Operating Temperature | TA | Commercial Grade | 0 | - | 70 | °C |
| Storage Temperature | TSTG | - | -55 | - | 150 | °C |
Instructions for Use:
Supply Voltage (VCC):
- Ensure the supply voltage is within the specified range of 4.75V to 5.25V to avoid damage to the device.
Input Voltage Levels:
- Inputs should be within the valid logic levels: VIL ≤ 0.8V for a low input and VIH ≥ 2.0V for a high input.
Output Voltage Levels:
- Outputs will be VOL ≤ 0.4V for a low output and VOH ≥ 2.4V for a high output under typical conditions.
Propagation Delay Time (tpd):
- The typical propagation delay time is 35ns at 5V and 25°C. This can vary with temperature and supply voltage.
Power Dissipation (PD):
- Do not exceed the maximum power dissipation of 500mW per package to prevent overheating and potential failure.
Operating Temperature (TA):
- The device is rated for commercial use with an operating temperature range of 0°C to 70°C. Ensure adequate cooling if operating near the upper limit.
Storage Temperature (TSTG):
- Store the device in a temperature range of -55°C to 150°C to maintain its integrity.
Handling Precautions:
- Handle the device with care to avoid static discharge, which can damage sensitive components.
- Use appropriate ESD protection when handling the device.
Mounting and Soldering:
- Follow recommended soldering profiles to ensure proper bonding without damaging the device.
- Avoid excessive heat during soldering, as it can cause thermal stress and reduce reliability.
Testing:
- Test the device under specified conditions to ensure it meets performance specifications.
- Use a suitable test setup to avoid introducing noise or other interference that could affect test results.
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