SN74LS89N

SN74LS89N


Specifications
SKU
12603232
Details

BUY SN74LS89N https://www.utsource.net/itm/p/12603232.html

Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC Operating 4.75 5.0 5.25 V
Input Low Voltage VIL VCC = 5V 0.8 - - V
Input High Voltage VIH VCC = 5V - - 2.0 V
Output Low Voltage VOL IL = 16mA 0.4 - - V
Output High Voltage VOH IH = -0.4mA - - 2.4 V
Propagation Delay Time tpd VCC = 5V, TA = 25°C - 35 - ns
Power Dissipation PD Per Package - - 500 mW
Operating Temperature TA Commercial Grade 0 - 70 °C
Storage Temperature TSTG - -55 - 150 °C

Instructions for Use:

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the specified range of 4.75V to 5.25V to avoid damage to the device.
  2. Input Voltage Levels:

    • Inputs should be within the valid logic levels: VIL ≤ 0.8V for a low input and VIH ≥ 2.0V for a high input.
  3. Output Voltage Levels:

    • Outputs will be VOL ≤ 0.4V for a low output and VOH ≥ 2.4V for a high output under typical conditions.
  4. Propagation Delay Time (tpd):

    • The typical propagation delay time is 35ns at 5V and 25°C. This can vary with temperature and supply voltage.
  5. Power Dissipation (PD):

    • Do not exceed the maximum power dissipation of 500mW per package to prevent overheating and potential failure.
  6. Operating Temperature (TA):

    • The device is rated for commercial use with an operating temperature range of 0°C to 70°C. Ensure adequate cooling if operating near the upper limit.
  7. Storage Temperature (TSTG):

    • Store the device in a temperature range of -55°C to 150°C to maintain its integrity.
  8. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Use appropriate ESD protection when handling the device.
  9. Mounting and Soldering:

    • Follow recommended soldering profiles to ensure proper bonding without damaging the device.
    • Avoid excessive heat during soldering, as it can cause thermal stress and reduce reliability.
  10. Testing:

    • Test the device under specified conditions to ensure it meets performance specifications.
    • Use a suitable test setup to avoid introducing noise or other interference that could affect test results.
(For reference only)

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