MIC5205-5.0YM5-TR

MIC5205-5.0YM5-TR


Specifications
Details

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Parameter Symbol Conditions Min Typ Max Unit
Input Voltage VIN Operating Range 2.7 - 5.5 V
Output Voltage VOUT Fixed Output - 5.0 - V
Quiescent Current IQ VIN = 5V, IOUT = 0mA - 1.8 - 渭A
Dropout Voltage VD IOUT = 300mA - 0.3 - V
Load Regulation IOUT = 0mA to 300mA - 0.4 - %
Line Regulation VIN = 2.7V to 5.5V - 0.1 - %
Power Supply Rejection Ratio PSRR f = 1kHz - 70 - dB
Operating Junction Temperature TJ - -40 - 125 掳C

Instructions for MIC5205-5.0YM5-TR

  1. Input Voltage (VIN):

    • Ensure the input voltage is within the operating range of 2.7V to 5.5V. Exceeding this range can damage the device.
  2. Output Voltage (VOUT):

    • The MIC5205-5.0YM5-TR provides a fixed output voltage of 5.0V. No external components are required to set the output voltage.
  3. Quiescent Current (IQ):

    • The quiescent current is very low at 1.8渭A when the input voltage is 5V and no load is applied. This makes the device suitable for battery-operated applications.
  4. Dropout Voltage (VD):

    • The dropout voltage is typically 0.3V at an output current of 300mA. Keep this in mind when designing the power supply to ensure sufficient headroom.
  5. Load Regulation:

    • The load regulation is specified as 0.4%, indicating minimal change in output voltage over the load range from 0mA to 300mA.
  6. Line Regulation:

    • The line regulation is 0.1% across the input voltage range from 2.7V to 5.5V, ensuring stable output voltage with varying input conditions.
  7. Power Supply Rejection Ratio (PSRR):

    • With a PSRR of 70dB at 1kHz, the device effectively filters out noise from the input power supply.
  8. Operating Junction Temperature (TJ):

    • The device operates safely within temperatures ranging from -40掳C to 125掳C. Ensure adequate heat dissipation if used in high-temperature environments.
  9. Application Considerations:

    • Place bypass capacitors close to the input and output pins to minimize noise and improve stability.
    • Ensure proper PCB layout practices to avoid thermal issues and electromagnetic interference (EMI).
(For reference only)

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