Details

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BUY LTC4412HVIS6#TRPBF https://www.utsource.net/itm/p/12603800.html

Parameter	Symbol	Min	Typical	Max	Unit	Description
Input Voltage	VIN	3.5	-	40	V	Operating input voltage range
Output Voltage	VOUT	3.5	-	40	V	Controlled output voltage
Reverse Current	IREV	-	0.1	1	渭A	Reverse leakage current
Control Threshold	VCTRL	0.7	0.9	1.1	V	Control threshold for ideal diode operation
Gate Drive Voltage	VGS	4.5	-	20	V	Gate drive voltage for external MOSFET
Quiescent Current	IQ	-	30	50	渭A	Supply current in active state
Shutdown Current	ISD	-	0.1	1	渭A	Supply current in shutdown mode
Thermal Shutdown	TSD	160	-	-	掳C	Temperature at which thermal shutdown occurs
Operating Temperature	TOPR	-40	-	125	掳C	Operating temperature range
Storage Temperature	TSTG	-65	-	150	掳C	Storage temperature range

Instructions for Use

1. Circuit Configuration:

   • Connect the VIN pin to the input power supply.
   • Connect the VOUT pin to the load or next stage of the circuit.
   • Connect the GATE pin to the gate of the external MOSFET.
   • Connect the SOURCE pin to the source of the external MOSFET.
   • Connect the CTRL pin to a control signal if using the device in controlled mode.

2. External Components:

   • Use an external N-channel MOSFET with appropriate ratings for the application.
   • Ensure the MOSFET has a low Rds(on) to minimize power loss.

3. Thermal Management:

   • Place the device on a PCB with adequate copper area for heat dissipation.
   • Consider adding a heatsink if operating at high power levels.

4. Power-Up Sequence:

   • Ensure the input voltage is within the specified range before applying power.
   • Allow the device to stabilize before connecting the load.

5. Shutdown Mode:

   • To enter shutdown mode, pull the EN pin low.
   • The device will draw minimal current in this state.

6. Reverse Current Protection:

   • The device automatically blocks reverse current flow when the input voltage is lower than the output voltage.

7. Thermal Shutdown:

   • The device will shut down if the junction temperature exceeds 160掳C to prevent damage.
   • Allow the device to cool down before reapplying power.

8. Storage and Handling:

   • Store the device in a dry environment within the specified storage temperature range.
   • Handle with care to avoid static discharge and mechanical damage.

For detailed schematics and further information, refer to the datasheet provided by Linear Technology (now part of Analog Devices).

(For reference only)