IRFPS37N50A

IRFPS37N50A


Specifications
Details

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Parameter Symbol Min Typ Max Unit Description
Drain-Source Voltage V(DSS) - 500 - V Maximum drain-to-source voltage
Gate-Source Voltage V(GSS) -10 - 10 V Maximum gate-to-source voltage
Continuous Drain Current I(D) - 7.9 - A Continuous drain current at Tc=25掳C
Pulse Drain Current I(D pul) - 38 - A Pulse drain current (t < 10渭s)
Power Dissipation P(TOT) - 64 - W Total power dissipation
Junction Temperature T(J) - - 175 掳C Maximum junction temperature
Storage Temperature T(STG) -55 - 150 掳C Operating temperature range

Instructions for Use:

  1. Mounting and Handling:

    • Ensure proper heat sinking when operating at high currents or in high ambient temperatures to maintain junction temperature within limits.
    • Handle with care to avoid damage to the leads and body.
  2. Electrical Connections:

    • Connect the gate lead carefully to avoid parasitic inductance which can cause spurious turn-on.
    • Ensure all connections are secure and insulated to prevent short circuits.
  3. Gate Drive:

    • Apply a sufficient gate drive voltage to ensure full enhancement of the MOSFET.
    • Avoid exceeding the maximum gate-source voltage ratings to prevent gate oxide breakdown.
  4. Thermal Management:

    • Monitor the junction temperature, especially during high-power operations.
    • Use thermal management techniques such as heatsinks or forced air cooling if necessary.
  5. Storage and Operation:

    • Store in a dry, cool environment away from direct sunlight.
    • Operate within the specified storage temperature range to ensure reliability and longevity.
  6. Safety Precautions:

    • Always use appropriate protective equipment when handling electronic components.
    • Follow all safety guidelines to prevent electrical shock and component damage.
(For reference only)

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