Details

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BUY TC4420CPA https://www.utsource.net/itm/p/12603870.html

Parameter	Symbol	Conditions	Min	Typical	Max	Unit
Supply Voltage	VCC	Continuous Operation	4.5	-	18	V
Output High-Level Voltage	VOH	IO = -10 mA, VCC = 15 V	13.5	-	15	V
Output Low-Level Voltage	VOL	IO = 10 mA, VCC = 15 V	0	-	0.6	V
Propagation Delay Time (High to Low)	tPLH	VCC = 15 V, VI = VCC/2, VO = VCC/2	-	25	-	ns
Propagation Delay Time (Low to High)	tPHL	VCC = 15 V, VI = VCC/2, VO = VCC/2	-	25	-	ns
Quiescent Current	IQ	No Load, VCC = 15 V	-	1.5	-	mA
Input High-Level Voltage	VIH	II = -1 渭A	2.0	-	VCC	V
Input Low-Level Voltage	VIL	II = 1 渭A	0	-	0.8	V
Maximum Output Current	IOMAX	Continuous Operation, VCC = 15 V	-	-	250	mA

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 4.5 V to 18 V.
   • Connect the V_CC pin to the power supply and the GND pin to ground.

2. Input Signals:

   • The input high-level voltage (V_IH) should be at least 2.0 V and can go up to V_CC.
   • The input low-level voltage (V_IL) should be no more than 0.8 V.
   • Ensure the input current (I_I) is within the specified limits.

3. Output Signals:

   • The output high-level voltage (V_OH) will be close to V_CC when the output is high.
   • The output low-level voltage (V_OL) will be close to 0 V when the output is low.
   • The maximum continuous output current (I_OMAX) is 250 mA.

4. Propagation Delay:

   • The propagation delay times (t_PLH and t_PHL) are typically 25 ns at V_CC = 15 V.

5. Quiescent Current:

   • The quiescent current (I_Q) is typically 1.5 mA with no load and V_CC = 15 V.

6. Operating Temperature:

   • The device is designed to operate over a wide temperature range, typically from -40掳C to +125掳C.

7. Handling and Storage:

   • Handle the device with care to avoid static damage.
   • Store the device in a dry, cool place away from direct sunlight and sources of heat.

8. Mounting:

   • Ensure proper soldering and mounting techniques to avoid mechanical stress on the device.
   • Use appropriate heat sinks if necessary to manage thermal dissipation.

(For reference only)