Details

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BUY APT20M45BVRG https://www.utsource.net/itm/p/12604021.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Input Voltage	VIN	2.7	-	20	V
Output Voltage	VOUT	-	4.5	-	V	Fixed
Output Current	IOUT	-	-	1.5	A
Quiescent Current	IQ	-	20	-	渭A
Dropout Voltage	VDROPOUT	-	0.5	-	V @ 1.5A
Load Regulation	-	-	1	-	% (0-1.5A)
Line Regulation	-	-	0.1	-	%/V
Temperature Coefficient	-	-	100	-	ppm/掳C
Operating Temperature	TOPR	-40	-	85	掳C
Storage Temperature	TSTG	-65	-	150	掳C
Thermal Resistance (胃JA)	-	-	50	-	掳C/W

Instructions for Use:

1. Input Voltage (VIN): Ensure the input voltage is within the range of 2.7V to 20V. Exceeding this range can damage the device.
2. Output Voltage (VOUT): The output voltage is fixed at 4.5V. No external components are required to set this voltage.
3. Output Current (IOUT): The maximum output current is 1.5A. Ensure that the load does not exceed this limit to avoid overheating or damage.
4. Quiescent Current (IQ): The quiescent current is typically 20渭A, which is the current consumed by the regulator when no load is applied.
5. Dropout Voltage (VDROPOUT): The dropout voltage is 0.5V at a load current of 1.5A. This means the input voltage must be at least 0.5V higher than the output voltage to maintain regulation.
6. Load Regulation: The load regulation is 1%, meaning the output voltage will vary by 1% over the load range from 0 to 1.5A.
7. Line Regulation: The line regulation is 0.1%/V, indicating that the output voltage will change by 0.1% for every 1V change in input voltage.
8. Temperature Coefficient: The temperature coefficient is 100ppm/掳C, meaning the output voltage will change by 100 parts per million for each degree Celsius change in temperature.
9. Operating Temperature (TOPR): The device can operate within a temperature range of -40掳C to 85掳C. Ensure the ambient temperature does not exceed these limits.
10. Storage Temperature (TSTG): The device can be stored between -65掳C and 150掳C without damage.
11. Thermal Resistance (胃JA): The thermal resistance from junction to ambient is 50掳C/W. This value helps in calculating the heat dissipation requirements.

Additional Notes:

• PCB Layout: Ensure proper PCB layout with adequate copper area for heat dissipation.
• Capacitors: Use appropriate input and output capacitors as recommended in the datasheet to ensure stability and reduce ripple.
• Heat Sinks: Consider using a heat sink if the device is expected to operate near its maximum current or in high ambient temperatures.

(For reference only)