Details

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BUY TQP3M9008 https://www.utsource.net/itm/p/12604218.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VDD	Operating	2.7	-	5.5	V
Supply Current	IDD	Quiescent, fin = 0 MHz	-	11	-	mA
Input Frequency Range	fin	Operating	400	-	6000	MHz
Output Power	Pout	fin = 2450 MHz, VDD = 5 V	21	-	-	dBm
Gain	G	fin = 2450 MHz, VDD = 5 V	13	-	-	dB
Return Loss (Input)	RLin	fin = 2450 MHz, VDD = 5 V	-	10	-	dB
Return Loss (Output)	RLout	fin = 2450 MHz, VDD = 5 V	-	10	-	dB
Isolation	ISO	fin = 2450 MHz, VDD = 5 V	-	-	25	dB
Harmonics	H2, H3	fin = 2450 MHz, VDD = 5 V	-	-	-40	dBc
Operating Temperature	Top	-	-40	-	85	掳C
Storage Temperature	Tstg	-	-55	-	150	掳C

Instructions for TQP3M9008:

1. Supply Voltage (V_DD):

   • Ensure the supply voltage is within the range of 2.7V to 5.5V.
   • Use a stable power supply to avoid fluctuations that can affect performance.

2. Supply Current (I_DD):

   • The quiescent current is typically 11 mA at 0 MHz input frequency. Ensure your power supply can handle this current.

3. Input Frequency Range (f_in):

   • The device operates within the frequency range of 400 MHz to 6000 MHz. Verify that your application falls within this range.

4. Output Power (P_out):

   • At 2450 MHz and 5V supply, the output power is 21 dBm. Adjust the input power and supply voltage as needed to achieve the desired output.

5. Gain (G):

   • The gain is 13 dB at 2450 MHz and 5V supply. This value can vary slightly depending on the specific operating conditions.

6. Return Loss:

   • Ensure the return loss at both input and output ports is at least 10 dB to maintain good signal integrity.

7. Isolation (ISO):

   • The isolation between input and output should be at least 25 dB to prevent feedback and interference.

8. Harmonics:

   • The second and third harmonics should be at least 40 dBc below the fundamental frequency to minimize distortion.

9. Operating Temperature (T_op):

   • The device can operate within a temperature range of -40掳C to 85掳C. Ensure proper thermal management to avoid overheating.

10. Storage Temperature (T_stg):

    • Store the device in an environment with temperatures ranging from -55掳C to 150掳C to ensure long-term reliability.

11. Handling:

    • Handle the device with care to avoid static discharge and physical damage. Use appropriate ESD protection when handling.

12. Mounting:

    • Follow recommended PCB layout guidelines to ensure optimal performance. Use ground planes and keep traces short to minimize parasitic effects.

13. Testing:

    • Test the device under specified conditions to verify its performance before integrating it into your system.

(For reference only)