Details

---

BUY IRFS38N20DTRRP https://www.utsource.net/itm/p/12604234.html

Parameter	Symbol	Test Conditions	Min	Typical	Max	Unit
Drain-Source Voltage	VDS	-	-	200	-	V
Gate-Source Voltage	VGS	-	-15	0	15	V
Continuous Drain Current (TC = 25掳C)	ID(25掳C)	VDS = 20V, TC = 25掳C	-	8	-	A
Continuous Drain Current (TC = 75掳C)	ID(75掳C)	VDS = 20V, TC = 75掳C	-	5.6	-	A
Pulse Drain Current (tp = 10ms, 1% Duty Cycle)	ID(pulsed)	VDS = 20V, tp = 10ms, 1% Duty Cycle	-	16	-	A
Total Power Dissipation (TC = 25掳C)	PTOT(25掳C)	-	-	115	-	W
Total Power Dissipation (TC = 75掳C)	PTOT(75掳C)	-	-	70	-	W
Junction Temperature	TJ	-	-	-	175	掳C
Storage Temperature Range	TSTG	-	-65	-	150	掳C
Gate Charge	QG	VGS = 10V, ID = 8A	-	44	-	nC
Input Capacitance	Ciss	VDS = 20V, f = 1MHz	-	1900	-	pF
Output Capacitance	Coss	VDS = 20V, f = 1MHz	-	55	-	pF
Reverse Transfer Capacitance	Crss	VDS = 20V, f = 1MHz	-	130	-	pF
On-State Resistance (TC = 25掳C)	RDS(on)(25掳C)	VGS = 10V, ID = 8A	-	0.038	-	惟
On-State Resistance (TC = 75掳C)	RDS(on)(75掳C)	VGS = 10V, ID = 8A	-	0.057	-	惟
Threshold Voltage	VGS(th)	ID = 250渭A	2.0	3.0	4.0	V
Maximum Gate-Source Voltage	VGS(max)	-	-	-	20	V

Instructions for Use:

1. Handling Precautions:

   • Handle the device with care to avoid static discharge damage.
   • Use proper ESD protection when handling the device.

2. Mounting and Assembly:

   • Ensure that the device is mounted on a suitable heatsink to dissipate heat effectively.
   • Follow the recommended PCB layout guidelines to minimize parasitic inductances and ensure stable operation.

3. Operating Conditions:

   • Do not exceed the maximum ratings specified in the table.
   • Ensure that the junction temperature does not exceed 175掳C.
   • Operate within the specified storage temperature range to prevent damage.

4. Gate Drive:

   • Apply a gate-source voltage (V_GS) within the recommended range to ensure reliable switching.
   • Use a gate resistor to control the rise and fall times of the gate signal, which helps in reducing switching losses and electromagnetic interference (EMI).

5. Thermal Management:

   • Monitor the temperature of the device during operation and ensure adequate cooling.
   • Use thermal paste or thermal interface materials to improve heat transfer between the device and the heatsink.

6. Testing and Verification:

   • Verify the device parameters using the test conditions specified in the table.
   • Perform functional tests under actual operating conditions to ensure the device meets the application requirements.

(For reference only)