Details
BUY TD62785P https://www.utsource.net/itm/p/12604406.html
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | - | 4.5 | - | 20 | V |
| Output Current | IO | Per output, Ta = 25掳C | - | 150 | - | mA |
| Power Dissipation | PD | Ta = 25掳C | - | - | 650 | mW |
| Operating Temp. | TOPR | - | -40 | - | 85 | 掳C |
| Storage Temp. | TSTG | - | -55 | - | 150 | 掳C |
Instructions for TD62785P:
- Supply Voltage: Ensure the supply voltage is within the range of 4.5V to 20V to avoid damage to the device.
- Output Current: Each output can handle up to 150mA at room temperature (25掳C). For higher temperatures or multiple outputs, ensure the total current does not exceed safe limits.
- Power Dissipation: The maximum power dissipation at room temperature is 650mW. Proper heat sinking may be required if operating near this limit.
- Operating Temperature: The device is designed to operate between -40掳C and 85掳C. Ensure environmental conditions are within this range.
- Storage Temperature: When not in use, store the device between -55掳C and 150掳C.
- Handling Precautions: Handle with care to avoid electrostatic discharge (ESD) damage. Use appropriate ESD protection measures during handling and installation.
- Mounting: Ensure proper mounting techniques to maintain thermal performance and mechanical integrity. Follow manufacturer guidelines for PCB layout and component placement.
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