Details

---

BUY BPC5563K https://www.utsource.net/itm/p/12604411.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VDD	1.8	-	5.5	V	Operating voltage range
Input Voltage Range	VIN	0	-	VDD	V	Input voltage range
Output Voltage Range	VOUT	0	-	VDD	V	Output voltage range
Output Current	IOUT	-	100	-	mA	Maximum continuous output current
Quiescent Current	IQ	-	10	-	渭A	Quiescent current
Dropout Voltage	VDROPOUT	-	200	-	mV	Typical dropout voltage at IOUT = 100mA
PSRR (10 Hz to 100 kHz)	PSRR	-	70	-	dB	Power supply rejection ratio
Thermal Shutdown	TSD	-	-	150	掳C	Thermal shutdown temperature
Operating Temperature	TOPR	-40	-	125	掳C	Operating temperature range
Storage Temperature	TSTG	-65	-	150	掳C	Storage temperature range

Instructions for Using BPC5563K

1. Power Supply Connection:

   • Connect the positive terminal of the power supply to the VDD pin.
   • Connect the negative terminal of the power supply to the GND pin.

2. Input and Output Connections:

   • Connect the input signal to the VIN pin.
   • Connect the load or output device to the VOUT pin.

3. Capacitor Placement:

   • Place a 10渭F ceramic capacitor between VDD and GND as close to the device as possible to ensure stable operation.
   • Place a 10渭F ceramic capacitor between VOUT and GND to filter out any noise and stabilize the output.

4. Thermal Management:

   • Ensure adequate heat dissipation by providing a heatsink if the device is expected to operate at high output currents or in high ambient temperatures.

5. Operating Temperature:

   • The device is designed to operate within the temperature range of -40掳C to 125掳C. Avoid operating outside this range to prevent damage.

6. Thermal Shutdown:

   • The device has built-in thermal protection that will shut down the output if the temperature exceeds 150掳C. Allow the device to cool before resuming operation.

7. Output Current Limitation:

   • The maximum continuous output current is 100mA. Exceeding this limit can cause the device to overheat and potentially fail.

8. Storage Temperature:

   • Store the device in an environment with a temperature range of -65掳C to 150掳C to avoid damage.

9. Electrostatic Discharge (ESD) Protection:

   • Handle the device with care to avoid ESD damage. Use proper ESD protection equipment and follow recommended handling procedures.

10. PCB Layout:

    • Ensure a clean and well-designed PCB layout to minimize noise and parasitic effects. Keep signal traces short and direct, especially for high-frequency signals.

By following these guidelines, you can ensure optimal performance and reliability of the BPC5563K in your application.

(For reference only)