Details

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BUY M27C4002-12F1 https://www.utsource.net/itm/p/12604642.html

Parameter	Description	Value
Device Type	High-Density CMOS EPROM	512K x 8
Package Type	Ceramic Dual In-Line Package (DIP)	28-Pin
Operating Voltage (Vcc)	Supply Voltage	4.5V to 5.5V
Standby Current (Icc)	Power Consumption in Standby Mode	5 渭A (max)
Active Current (Icc)	Power Consumption in Active Mode	30 mA (max)
Access Time (tAC)	Time from Address Valid to Data Valid	120 ns (max)
Cycle Time (tCYC)	Minimum Time Between Successive Cycles	150 ns (min)
Output Drive Capability	Output Current per Pin	卤10 mA
Data Retention	Guaranteed Data Retention Time	10 years
Programming Voltage (Vpp)	Programming Voltage for Writing Data	12.5V 卤 0.5V
Programming Time	Time Required for Programming a Single Location	1 ms (max)
Erase Time	Time Required for Erasing the Entire Device	10 seconds (max)
Operating Temperature	Temperature Range for Normal Operation	-40掳C to +85掳C
Storage Temperature	Temperature Range for Storage	-65掳C to +150掳C

Instructions

1. Power Supply:

   • Connect Vcc to a stable 5V supply.
   • Connect Vss to ground.

2. Address Lines:

   • Connect the address lines (A0-A18) to the appropriate address bus.

3. Data Lines:

   • Connect the data lines (D0-D7) to the data bus.

4. Control Signals:

   • Chip Select (CS): Low to enable the device.
   • Output Enable (OE): Low to enable data output.
   • Write Enable (WE): Not used in read mode, must be high during read operations.

5. Programming:

   • Apply 12.5V 卤 0.5V to Vpp.
   • Set the address lines to the desired location.
   • Set the data lines to the data to be written.
   • Pulse WE low for at least 1 ms to program the selected location.

6. Erasing:

   • Expose the device to UV light for at least 10 seconds to erase the entire memory.

7. Reading:

   • Set the address lines to the desired location.
   • Set CS and OE low.
   • Read the data from the data lines.

8. Standby Mode:

   • Set CS high to enter standby mode, reducing power consumption.

9. Handling:

   • Handle the device with care to avoid static damage.
   • Store in a dry environment to prevent moisture damage.

10. Mounting:

    • Ensure proper alignment of the device on the PCB.
    • Solder the device using a temperature-controlled soldering iron to avoid thermal stress.

(For reference only)