Details
BUY FQPF8N90CT https://www.utsource.net/itm/p/12604774.html
| Parameter | Symbol | Test Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | V(BR)DSS | IDS = 250渭A, TC = 25掳C | - | 900 | - | V |
| Gate-Source Voltage | VGS | ID = 0.1mA, TC = 25掳C | -10 | - | 10 | V |
| Continuous Drain Current | ID | TC = 25掳C | - | 8 | - | A |
| Pulse Drain Current | Ipp | tP = 300渭s, Duty Cycle = 1% | - | 64 | - | A |
| Total Power Dissipation | PD | TC = 25掳C | - | 187 | - | W |
| Junction Temperature | TJ | - | -55 | - | 150 | 掳C |
| Storage Temperature Range | TSTG | - | -55 | - | 150 | 掳C |
Instructions for Use:
- Handling Precautions: The FQPF8N90CT is sensitive to electrostatic discharge (ESD). Use appropriate ESD protection measures during handling and installation.
- Mounting: Ensure proper heat sinking if operating at or near maximum power dissipation levels to maintain junction temperature within safe limits.
- Gate Drive: Apply gate-source voltage within the specified range to avoid damaging the device.
- Continuous Operation: Do not exceed the continuous drain current rating to prevent overheating and potential failure.
- Pulse Operation: For pulse applications, ensure that the pulse duration and duty cycle do not exceed the specified limits to avoid exceeding the maximum allowable temperature rise.
- Storage: Store in a dry environment and follow recommended storage temperature ranges to ensure reliability.
- Testing: Verify all parameters under specified test conditions before deployment in final applications.
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