Details

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BUY ADM485AR https://www.utsource.net/itm/p/12604922.html

Parameter	Symbol	Conditions	Min	Typical	Max	Unit
Supply Voltage	VCC	Operating	4.75	-	5.25	V
Supply Current	ICC	No Load, VCC = 5V	-	100	-	渭A
Output Current	IOUT	Short Circuit Protection	-	250	-	mA
Data Rate	fDATA	Differential	-	250	-	kbps
Differential Input Voltage	VID	Input Range	-7	-	12	V
Common-Mode Input Voltage	VICM	Input Range	-7	-	12	V
Receiver Input Threshold	VIT	Differential	卤200	-	-	mV
Receiver Output High Level	VOH	VCC = 5V, IL = -4mA	2.4	-	5.0	V
Receiver Output Low Level	VOL	VCC = 5V, IL = 4mA	0.4	-	0.6	V
Driver Output High Level	VODH	VCC = 5V, IL = -4mA	2.4	-	5.0	V
Driver Output Low Level	VODL	VCC = 5V, IL = 4mA	0.4	-	0.6	V
Propagation Delay	tPD	Differential, VCC = 5V	-	350	-	ns
Skew	tSKW	Differential, VCC = 5V	-	50	-	ns
Operating Temperature	TOP	Commercial	-40	-	85	掳C

Instructions for Using ADM485AR

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 4.75V to 5.25V.
   • Connect the ground (GND) pin to the system ground.

2. Signal Lines:

   • Connect the differential data lines (A and B) to the corresponding lines of the communication bus.
   • Ensure proper termination resistors (typically 120惟) are used on the bus to prevent signal reflections.

3. Receiver and Driver Control:

   • The receiver output (RO) will be high or low based on the differential input voltage between A and B.
   • The driver enable (DE) and receiver enable (RE) pins control the direction of data flow. Set DE high to enable transmission and RE low to enable reception.

4. Data Rate:

   • The device supports data rates up to 250 kbps. Ensure the data rate is within this limit for reliable communication.

5. Short-Circuit Protection:

   • The device has built-in short-circuit protection. However, avoid prolonged short circuits to prevent damage.

6. Temperature Considerations:

   • Operate the device within the temperature range of -40掳C to 85掳C to ensure reliable performance.

7. Propagation Delay and Skew:

   • Be aware of the propagation delay and skew specifications to design appropriate timing margins in your communication protocol.

8. ESD Protection:

   • Handle the device with care to avoid electrostatic discharge (ESD). Use ESD protective equipment and follow standard handling procedures.

9. Mounting and Layout:

   • Follow recommended PCB layout guidelines to minimize noise and ensure optimal performance. Keep signal traces short and use ground planes to reduce interference.

10. Testing:

    • Test the device in a controlled environment to verify its operation before integrating it into a larger system. Use a known good test setup to validate the communication link.

(For reference only)